Light Emitting Device and Electronic Appliance

ABSTRACT

The present invention is to provide a light emitting device capable of obtaining a certain luminance without influence by the temperature change, and a driving method thereof. A current mirror circuit formed by using a transistor is provided for each pixel. The first transistor and the second transistor of the current mirror circuit are connected such that the drain currents thereof are maintained at proportional values regardless of the load resistance value. Thereby, a light emitting device capable of controlling the OLED driving current and the luminance of the OLED by controlling the drain current of the first transistor at a value corresponding to a video signal in a driving circuit, and supplying the drain current of the second transistor to the OLED, is provided.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/719,810, filed May 22, 2015, now allowed, which is a continuation ofU.S. application Ser. No. 14/330,074, filed Jul. 14, 2014, now U.S. Pat.No. 9,040,996, which is a continuation of U.S. application Ser. No.13/397,754, filed Feb. 16, 2012, now U.S. Pat. No. 8,780,018, which is acontinuation of U.S. application Ser. No. 12/760,598, filed Apr. 15,2010, now U.S. Pat. No. 8,120,557, which is a continuation of U.S.application Ser. No. 12/025,072, filed Feb. 4, 2008, now U.S. Pat. No.7,719,498, which is a continuation of U.S. application Ser. No.10/858,387, filed Jun. 2, 2004, now U.S. Pat. No. 7,336,035, which is acontinuation of U.S. application Ser. No. 10/077,830, filed Feb. 20,2002, now U.S. Pat. No. 6,753,654, which claims the benefit of a foreignpriority application filed in Japan as Serial No. 2001-045644 on Feb.21, 2001, all of which are incorporated by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to an OLED panel having an organic OLED(OLED: organic light emitting device) formed on a substrate, sealedbetween the substrate and a cover material. Moreover, it relates to anOLED module having an IC, or the like including a controller packaged onthe OLED panel. In this specification, both the OLED panel and the OLEDmodule are referred to as the light emitting device. Furthermore, thepresent invention relates to an electronic appliance using the lightemitting device.

Description of the Related Art

The OLED itself emits a light so as to provide a high visibility so thatbacklighting necessary for a liquid crystal display device (LCD) is notrequired, and thus it is suitable for providing a thin shape as well asthe view angle is not limited. Therefore, recently, a light emittingdevice using an OLED attracts the attention as the display device forreplacing the CRT and the LCD.

The OLED has a layer including an organic compound (organic lightemitting material) for obtaining a luminescence (electroluminescence) tobe generated by the application of the electric field (hereinafterreferred to as an organic light emitting layer), an anode layer, and acathode layer. The luminescence in an organic compound include the lightemission (fluorescence) at the time of returning from the singletexcitation state to the ground state, and the light emission(phosphorescence) at the time of returning from the triplet excitationstate to the ground state. In the light emitting device of the presentinvention, either one of the above-mentioned light emissions may beused, or both of the light emissions may be used as well.

In this specification, all the layers provided between the anode and thecathode of the OLED are defined to be an organic light emitting layer.Specifically, the organic light emitting layers include a light emittinglayer, a positive hole injecting layer, an electron injecting layer, apositive hole transporting layer, an electron transporting layer, or thelike. Basically, the OLED has a structure with the anode, the lightemitting layer, and the cathode successively. In addition to thestructure, it may have a structure with the anode, the positive holeinjecting layer, the light emitting layer, and the cathode, or astructure with the anode, the positive hole injecting layer, the lightemitting layer, the electron transporting layer, the cathode, or thelike in this order.

It has been problematic at the time of putting the light emitting deviceinto practice that the luminance of the OLED is lowered according todeterioration of the organic light emitting material.

The organic light emitting material is weak with respect to the moisturecontent, the oxygen, the light, and the heat so that deterioration ispromoted thereby. Specifically, the deterioration rate depends on thestructure of the device for driving the light emitting device, thecharacteristics of the organic light emitting material, the material ofthe electrode, the condition in the production step, the driving methodfor the light emitting device, or the like.

Even in the case the voltage applied on the organic light emitting layeris constant, if the organic light emitting layer is deteriorated, theluminance of the OLED is lowered so that the displayed image is notsharp. In this specification, a voltage applied to the organic lightemitting layer from a pair of electrodes is defined to be an OLEDdriving voltage (Vel).

Moreover, in a color display method using three kinds of the OLEDscorresponding to R (red), G (green), and B (blue), the organic lightemitting material comprising the organic light emitting layer differsdepending on the color corresponding to the OLED. Therefore, the organiclight emitting layers may deteriorate by different rates according tothe corresponding color. In this case, the luminance of the OLED differsper each color so that an image having a desired color cannot bedisplayed on the light emitting device.

Furthermore, the temperature of the organic light emitting layer dependson the heat of the external atmosphere, temperature of the heatgenerated by the OLED panel itself, or the like. In general, the OLEDhas the flowing current value changed according to the temperature. FIG.26 shows the change of the voltage current characteristics of the OLEDwith the temperature of the organic light emitting layer changed. In thecase the voltage is constant, if the temperature of the organic lightemitting layer is raised, the OLED driving current is enlarged. Sincethe OLED driving current and the luminance of the OLED have aproportional relationship, the higher the OLED driving current is, thehigher the luminance of the OLED is. Accordingly, since the luminance ofthe OLED is changed depending on the temperature of the organic lightemitting layer, it is difficult to display a desired gradient so thatthe current consumption of the light emitting device is enlargedaccording to the temperature rise.

Moreover, in general, since the degree of the change of the OLED drivingcurrent by the temperature change differs depending on the kind of theorganic light emitting material, the luminance of the OLEDs of eachcolor may change independently by the temperature in the color display.In the case the luminance of each color is not balanced, desired colorcannot be displayed.

SUMMARY OF THE INVENTION

Accordingly, in view of the above-mentioned circumstances, an object ofthe present invention is to provide a light emitting device capable ofobtaining a constant luminance regardless of the organic light emittinglayer deterioration or the temperature change, and further capable ofproviding a desired color display.

The present inventor has paid attention to the fact that the OLEDluminance decline by the deterioration is smaller in the latter case incomparison between the light emission with the OLED driving voltagemaintained constantly (the former case) and the light emission with thecurrent flowing in the OLED maintained constantly (the latter case). Inthis specification, the current flowing in the OLED is referred to asthe OLED driving current (Iel). Then, it is considered that the changeof the OLED luminance by the OLED deterioration can be prevented bycontrolling the OLED luminance not by the voltage but by the current.

Specifically, in the present invention, a current mirror circuitcomprising a transistor is provided in each pixel so that the OLEDdriving current is controlled using the current mirror circuit. Then,the first transistor and the second transistor of the current mirrorcircuit are connected such that the drain currents thereof can bemaintained at the substantially equal value regardless of the loadresistance value.

In this specification, a size of a current is an absolute value of acurrent.

The first transistor has the drain current thereof controlled by asignal line driving circuit. Since the size of the drain current I₁ isprovided always equal to the size of the drain current I₂ of the secondtransistor regardless of the load resistance value, as a result, thedrain current I₂ of the second transistor is controlled by the signalline driving circuit.

The second transistor is connected such that the drain current I₂thereof flows into the OLED. Therefore, the value of the OLED drivingcurrent flowing in the OLED is controlled not by the load resistance butby the signal driving circuit. In other words, the OLED driving currentcan be controlled at a desired value regardless of the difference of thetransistor characteristics, deterioration of the OLED, or the like.

In the present invention, according to the above-mentionedconfiguration, decline of the luminance of the OLED can be restrainedeven in the case the organic light emitting layer is deteriorated, andas a result, a sharp image can be displayed. Moreover, in the case of acolor display light emitting device using the OLED corresponding to eachcolor, even in the case the organic light emitting layers of the OLEDare deteriorated by different rates per each corresponding color, adesired color can be displayed by preventing deterioration of thebalance of the luminance among the colors.

Furthermore, even in the case the temperature of the organic lightemitting layer is influenced by the external atmosphere temperature, theheat generated by the OLED panel itself, or the like, the OLED drivingcurrent can be controlled at a desired value. Therefore, since the OLEDdriving current and the luminance of the OLED are proportional, changeof the luminance of the OLED can be restrained, and further, increase ofthe current consumption according to the temperature rise can beprevented. Moreover, in the case of a color display light emittingdevice, since change of the luminance of the OLED of each color can berestrained regardless of the temperature change, deterioration of thebalance of the luminance among the colors can be prevented so that adesired color can be displayed.

Furthermore, in general, since the degree of the change of the OLEDdriving current in the temperature change differs depending on the kindof the organic light emitting material, the luminance of the OLED ofeach color can be changed independently in the color display. However,according to the light emitting device of the present invention, since adesired luminance can be obtained regardless of the temperature change,deterioration of the balance of the luminance among the colors can beprevented so that a desired color can be displayed.

Moreover, in an ordinary light emitting device, since the wiring forsupplying the current to each pixel itself has a resistance, thepotential thereof is slightly lowered depending on the length of thewiring. The potential decline differs largely depending also on theimage to be displayed. In particular, in the case the ratio of pixels ofa high gradient number is high in a plurality of pixels having thecurrent supplied from the same wiring, the current flowing in the wiringis increased so that the potential decline becomes conspicuous. In thecase the potential is lowered, since the voltage applied on the OLED Ofeach pixel becomes small, the current supplied to each pixel becomessmall. Therefore, even in the case a constant gradient is to bedisplayed in a predetermined pixel, if the gradient number of the otherpixel having the current supplied from the same wiring is changed, thecurrent supplied to the predetermined pixel is changed thereby so thatthe gradient number is changed as a result. However, according to thelight emitting device of the present invention, since the OLED currentcan be corrected by obtaining the measured value and the reference valuefor each image to be displayed, a desired gradient number can bedisplayed by the correction even in the case the image to be displayedis changed.

In the light emitting device of the present invention, the transistor tobe used for the pixel may be a transistor using a single crystalsilicon, or a thin film transistor using a polycrystalline silicon or anamorphous silicon.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an upper surface block diagram of a light emitting device ofthe present invention.

FIG. 2 is a circuit diagram of a pixel of the light emitting device ofthe present invention.

FIGS. 3A and 3B are timing charts of signals to be inputted in scanninglines.

FIGS. 4A and 4B are schematic diagrams of pixels in driving.

FIG. 5 is a chart showing the timing of a writing period and a displayperiod appearing in an analog driving method.

FIG. 6 is a chart showing the timing of a writing period and a displayperiod appearing in a digital driving method.

FIG. 7 is a circuit diagram of a pixel of the light emitting device ofthe present invention.

FIG. 8 is a circuit diagram of a pixel of the light emitting device ofthe present invention.

FIGS. 9A to 9D are diagrams showing a production method for a lightemitting device of the present invention.

FIGS. 10A to 10C are diagrams showing a production method for a lightemitting device of the present invention.

FIGS. 11A and 11B are diagrams showing a production method for a lightemitting device of the present invention.

FIG. 12 is a top view of a pixel of a light emitting device of thepresent invention.

FIG. 13 is a cross-sectional view of a pixel of the light emittingdevice of the present invention.

FIGS. 14A and 14B are diagrams showing a production method for a lightemitting device of the present invention.

FIG. 15 is a top view of a pixel of a light emitting device of thepresent invention.

FIG. 16 is a top view of a pixel of a light emitting device of thepresent invention.

FIG. 17 is a block diagram of a signal line driving circuit.

FIG. 18 is a detailed chart of a signal line driving circuit in adigital driving method.

FIG. 19 is a circuit diagram of a current setting circuit in a digitaldriving method.

FIG. 20 is a block diagram of a scanning line driving circuit.

FIG. 21 is a chart showing the timing of a writing period and a displayperiod appearing in a digital driving method.

FIG. 22 is a chart showing the timing of writing period and a displayperiod appearing in a digital driving method.

FIG. 23 is a chart showing the timing of a writing period and a displayperiod appearing in a digital driving method.

FIGS. 24A to 24C are an external appearance diagram and cross-sectionalviews of a light emitting device of the present invention.

FIGS. 25A to 25H are diagrams of an electronic appliance using the lightemitting device of the present invention.

FIG. 26 is a graph showing the voltage current characteristics of theOLED.

FIG. 27 is a cross-sectional view of a pixel of a light emitting deviceof the present invention.

FIG. 28 is a top view of an element substrate of a light emitting deviceof the present invention.

FIG. 29 is an enlarged diagram of the element substrate of the lightemitting device of the present invention.

FIGS. 30A to 30C are circuit diagrams of a pixel of a light emittingdevice of the present invention.

FIGS. 31A and 31B are a detailed chart of a signal line driving circuitin a digital driving method.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1

FIG. 1 is a block diagram showing the configuration of an OLED panel ofthe present invention. The numeral 100 is a pixel part, with a pluralityof pixels 101 formed in a matrix-like form. Moreover, the numeral 102 isa signal line driving circuit, and the numeral 103 is a scanning linedriving circuit.

Although the signal line driving circuit 102 and the scanning linedriving circuit 103 are formed on the same substrate as the pixel part100 in FIG. 1, the present invention is not limited to theconfiguration. It is possible that the signal line driving circuit andthe scanning line driving circuit 103 are formed on a substratedifferent from that of the pixel part 100, and connected with the pixelpart 100 via a connector such as an FPC. Moreover, although the signalline driving circuit 102 and the scanning line driving circuit 103 areprovided one by one in FIG. 1, the present invention is not limited tothe configuration. The number of the signal line driving circuit 102 andthe scanning line driving circuit 103 can be set optionally by thedesigner.

In this specification, the connection denotes electric connection.

Moreover, in FIG. 1, signal lines S1 to Sx, power source lines V1 to Vx,and scanning lines G1 to Gy are provided in the pixel part 100. Thenumbers of the signal line and the power source line are not alwayssame. Moreover, another different wiring may be provided in addition tothese wirings.

The power source lines V1 to Vx are maintained at a predeterminedpotential. Although the configuration of a light emitting device fordisplaying a monochrome image is shown in FIG. 1, the present inventioncan be adopted in a light emitting device for displaying a color image.In that case, the amount of the potentials in the power source lines V1to Vx need not be maintained equally, and it may differ for eachcorresponding color.

The configuration of the pixel 101 shown in FIG. 1 is shown in detail inFIG. 2. The pixel 101 shown in FIG. 2 has a signal line Si (one of theS1 to Sx), a scanning line Gj (one of the G1 to Gy), and a power sourceline Vi (one of the V1 to Vx).

Moreover, the pixel 101 has at least a transistor Tr1 (the first currentdriving transistor or the first transistor), a transistor Tr2 (thesecond current driving transistor or the second transistor), atransistor Tr3 (first switching transistor or the third transistor), atransistor Tr4 (second switching transistor or the fourth transistor),an OLED 104 and a maintaining capacity 105.

The gate electrodes of the transistor Tr3 and the transistor Tr4 areboth connected with the scanning line Gj.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line Si, and the other one is connected withthe drain area of the transistor Tr1. Moreover, one of the source areaand the drain area of the transistor Tr4 is connected with the signalline Si, and the other one is connected with the gate electrode of thetransistor Tr1.

The gate electrodes of the transistor Tr1 and the transistor Tr2 areconnected with each other. Moreover, the source areas of the transistorTr1 and the transistor Tr2 are both connected with the power source lineVi.

The drain area of the transistor Tr2 is connected with a pixel electrodeof the OLED 104. The OLED 104 has an anode and a cathode. In thisspecification, in the case the anode is used as the pixel electrode(first electrode), the cathode is referred to as the counter electrode(second electrode), and in the case the cathode is used as the pixelelectrode, the anode is referred to as the counter electrode.

The potential of the power source line Vi (power source potential) ismaintained at a constant level. Moreover, the potential of the counterelectrode is maintained at a constant level as well.

The transistor Tr3 and the transistor Tr4 may either be an n channeltype TFT or a p channel type TFT. However, the polarity of thetransistor Tr3 and the transistor Tr4 is same.

Moreover, the transistor Tr1 and the transistor Tr2 may either be an nchannel type TFT or a p channel type TFT. However, the polarity of thetransistor Tr1 and the transistor Tr2 is same. In the case the anode isused as the pixel electrode and the cathode is used as the counterelectrode, the transistor Tr1 and the transistor Tr2 are used as the pchannel type TFT. In contrast, in the case the anode is used as thecounter electrode and the cathode is used as the pixel electrode, thetransistor Tr1 and the transistor Tr2 are used as the n channel typeTFT.

The maintaining capacity 105 is formed between the gate electrodes ofthe transistor Tr1 and the transistor Tr2 and the power source line Vi.Although the maintaining capacity 105 is provided for maintaining moresecurely the voltage (gate voltage) between the gate electrodes of thetransistor Tr1 and the transistor Tr2 and the source area, it is notalways necessarily provided.

Next, the drive of the light emitting device of the present inventionwill be explained with reference to FIG. 3 and FIG. 4. The drive of thelight emitting device of the present invention can be explained for awriting period Ta and a display period Td. In FIG. 3, the timing chartfor each scanning line is shown. The period with the scanning lineselected, in other words, the period with all the TFTs having thescanning line connected with a gate electrode in the on state isreferred to as ON. In contrast, the period of the scanning line notselected, in other words, the period with all the TFTs having thescanning line connected with a gate electrode in the off state isreferred to as OFF. Moreover, FIG. 4 is a diagram schematically showingthe connection of the transistor Tr3 and the transistor Tr4 in thewriting period Ta and the display period Td.

As shown in FIG. 3A, in the writing period Ta, the scanning lines G1 toGy are selected successively. Then, based on the potential of a videosignal inputted to the signal line driving circuit 102, a constantcurrent Ic flows each between the signal lines S1 to Sx and the powersource lines V1 to Vx. In this specification, the current Ic is referredto as a signal current.

FIG. 4A is a schematic diagram of the pixel 101 of the case the constantcurrent Ic flows in the signal line Si in the writing period Ta. Thenumeral 106 is a connection terminal for the power source for providingthe potential to the counter electrode. Moreover, the numeral 107denotes a constant current source of the signal line driving circuit102.

Since the transistor Tr3 and the transistor Tr4 are in the on state, inthe case a constant current Ic is provided in the signal line Si, theconstant current Ic flows between the drain area and the source area ofthe transistor TR1. At the time, the size of the current Ic iscontrolled in the constant current source 107 such that the transistorTr1 is operated in a saturated area. In the saturated area, with thepremise that V_(GS) is a potential difference between the gate electrodeand the source area (gate voltage), μ is the mobility of the transistor,C_(o) is the gate capacity per unit area, W/L is the ratio of thechannel width W and the channel length L in the channel formation area,V_(TH) is the threshold, μ is the mobility, and I₁ is the drain currentof the transistor Tr1, the following formula 1 can be satisfied.

I ₁ =μC _(o) W/L(V _(GS) −V _(TH))²/2  [Formula 1]

In the formula 1, all of μ, C_(o), W/L, and V_(TH) are a fixed valuedetermined by each transistor. Moreover, the drain current I1 of thetransistor TR1 is maintained at constant Ic by the constant currentsource 107. Therefore, as it is apparent from the formula 1, the gatevoltage V_(GS) of the transistor Tr1 is determined by the current valueIc.

The gate electrode of the transistor Tr2 is connected with the gateelectrode of the transistor Tr1. Moreover, the source area of thetransistor Tr2 is connected with the source area of the transistor Tr1.As a result, the gate voltage of the transistor Tr1 becomes the gatevoltage of the transistor Tr2. Therefore, the drain current I₂ of thetransistor Tr2 is maintained in the same size as the drain current ofthe transistor Tr1. That is, I₂=Ic.

The drain current I₂ of the transistor Tr2 flows into the OLED 104.Therefore, the OLED driving current has the same size as that of theconstant current Ic determined in the constant current source 107.

The OLED 104 emits a light by a luminance corresponding to the size ofthe OLED driving current. In the case the OLED driving current isextremely close to 0, or the OLED driving current flows in the counterbias direction, the OLED 104 does not emit a light.

When selection of all the scanning lines G1 to Gy is finished, and theabove-mentioned operation is executed for pixels in all the lines, thewiring period Ta is finished. When the writing period Ta is finished,the display period Td is started.

FIG. 3B is a timing chart for a scanning line in the display period Td.In the display period Td, none of the scanning lines G1 to Gy isselected.

FIG. 4B is a schematic diagram of a pixel in the display period Td. Thetransistor Tr3 and the transistor Tr4 are in the off state. Moreover,the source area of the transistor Tr3 and the transistor Tr4 areconnected with the power source line Vi so as to be maintained at aconstant potential (power source potential).

In the display period Td, the drain area of the transistor Tr1 is in theso-called floating state without supply of a potential from anotherwiring, a power source, or the like. In contrast, in the transistor Tr2,V_(GS) determined in the writing period Ta is maintained as it is.Therefore, the drain current I₂ value of the transistor Tr2 is stillmaintained at Ic. Therefore, in the display period Td, the OLED 104emits a light by a luminance corresponding to the size of the OLEDdriving current determined in the writing period Ta.

In the case of a driving method using an analog video signal (analogdriving method), the Ic size is determined according to the analog videosignal so that the OLED 104 emits a light by a luminance correspondingto the size of the IC so as to display a gradient. In this case, theframe period comprising a writing period Ta and a display period Td sothat an image is displayed in the frame period.

FIG. 5 shows an example of a timing chart in the analog driving method.One period has y sets of line periods. In each line period, eachscanning line is selected. In each line period, a constant current IC(Ic1 to Icx) flows in each signal line. In FIG. 5, the signal currentvalue flowing in each signal line in the line period Lj (j=1 to y) isrepresented as Ic1 [Lj] to Icx [Lj].

The timing of starting the writing period Ta and the display period Tddiffers in each line so that the timings of appearance of the writingperiod of each line do not coincide. When the display period Td isfinished in all the pixels, an image is displayed.

In contrast, in the case of a time gradient driving method using adigital video signal (digital driving method), an image can be displayedby repeated appearance of the writing period Ta and the display periodTd in one frame period. In the case of displaying an image by an n bitvideo signal, at least n sets of the writing periods and n sets of thedisplay periods are provided in one frame period. N sets of the writingperiods (Ta1 to Tan) and n sets of the display periods (Td1 to Tdn)correspond to each bit of the video signal.

FIG. 6 shows the timing of appearance of n sets of the writing periods(Ta1 to Tan) and n sets of the display periods (Td1 to Tdn) in one frameperiod. The lateral axis represents the time and the vertical axisrepresents the position of the scanning line of the pixel.

After the writing period Tam (m is an optional number from 1 to n), thedisplay period corresponding to the same bit number, in this case, Tdmappears. Total of the writing period Ta and the display period Td iscalled a sub frame period SF. The sub frame period having the writingperiod Tam and the display period Tdm corresponding to the m-th bit isSFm.

The length of the sub frame periods SF1 to SFn satisfies SF1:SF2: . . .:SFn=2⁰:2¹: . . . :2^(n-1).

For improvement of the image quality in display, a sub frame period witha long display period may be divided in some. Since a specific dividingmethod is disclosed in Japanese Patent Laid Open Application (JP-A) No.2000-267164, it can be referred to.

In the driving method shown in FIG. 6, the gradient is displayed bycontrolling the sum of the display period length with light emission inone frame period.

In the present invention, according to the above-mentionedconfiguration, decline of the luminance of the OLED can be restrainedeven in the case the organic light emitting layer is deteriorated, andas a result, a sharp image can be displayed. Moreover, in the case of acolor display light emitting device using an OLED corresponding to eachcolor, a desired color can be displayed by preventing collapse of theluminance balance of each color even in the case the organic lightemitting layers of the OLED are deteriorated by different rates per eachcorresponding color.

Moreover, even in the case the temperature of the organic light emittinglayer is influenced by the external atmosphere temperature, the heatgenerated by the OLED panel itself, or the like, the OLED drivingcurrent can be controlled at a desired value. Therefore, since the OLEDdriving current and the OLED luminance are proportional, change of theOLED luminance can be restrained as well as increase of the currentconsumption according to the temperature rise can be prevented.Moreover, in the case of the color display light emitting device, sincethe luminance change of the OLED of each color can be restrained withoutinfluence by the temperature change, collapse of the luminance balanceof each color can be prevented, and thus a desired color can bedisplayed.

Furthermore, since the OLED driving current change degree by thetemperature in general differs depending on the kind of the organiclight emitting material, the OLED luminance of each color in the colordisplay may be changed independently by the temperature. However,according to the light emitting device of the present invention, since adesired luminance can be obtained without influence by the temperaturechange, collapse of the luminance balance of each color can be preventedso that a desired color can be displayed.

Moreover, since the wiring for supplying a current to each pixel itselfhas a resistance in a common light emitting device, the potentialthereof is slightly lowered depending on the wiring length. Thepotential decline differs largely also by the image to be displayed. Inparticular, in the case the ratio of pixels with a high gradient numberis large in a plurality of the pixels having a current supplied from thesame wiring, the current flowing in the wiring becomes large so that thepotential decline appears significantly. Since the voltage on each OLEDof each pixel becomes small in the case of the potential decline, thecurrent supplied to each pixel becomes small. Therefore, even if aconstant gradient is to be displayed in a predetermined pixel, if thegradient number of the other pixel having the current supplied from thesame wiring is changed, the current supplied to the predetermined pixelis changed accordingly, and consequently, the gradient number is changedas well. However, according to the light emitting device of the presentinvention, since the OLED current can be corrected by obtaining themeasured value and the reference value for each image to be displayed, adesired gradient number can be displayed by correction even in the casethe image to be displayed is changed.

Embodiment 2

In this embodiment, a configuration of the pixel 101 shown in FIG. 1different from that of FIG. 2 will be explained.

FIG. 7 shows the configuration of the pixel of this embodiment. Thepixel 101 shown in FIG. 7 has a signal line Si (one from S1 to Sx), ascanning line Gj (one from G1 to Gy), and a power source line Vi (onefrom V1 to Vx).

Moreover, the pixel 101 comprises at least a transistor Tr1 (firstcurrent driving transistor), a transistor Tr2 (second current drivingtransistor), a transistor Tr3 (first switching transistor), a transistorTr4 (second switching transistor), an OLED 104 and a maintainingcapacity 105.

The gate electrodes of the transistor Tr3 and the transistor Tr4 areboth connected with the scanning line Gj.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line Si, and the other one is connected withthe drain area of the transistor Tr1. Moreover, one of the source areaand the drain area of the transistor Tr4 is connected with the drainarea of the transistor Tr1, and the other one is connected with the gateelectrode of the transistor Tr1.

The gate electrodes of the transistor Tr1 and the transistor Tr2 areconnected with each other. Moreover, the source areas of the transistorTr1 and the transistor Tr2 are both connected with the power source lineVi.

The drain area of the transistor Tr2 is connected with a pixel electrodeof the OLED 104. The potential of the power source line Vi (power sourcepotential) is maintained at a constant level. Moreover, the potential ofthe counter electrode is maintained at a constant level as well.

The transistor Tr3 and the transistor Tr4 may either be an n channeltype TFT or a p channel type TFT. However, the polarity of thetransistor Tr3 and the transistor Tr4 is same.

Moreover, the transistor Tr1 and the transistor Tr2 may either be an nchannel type TFT or a p channel type TFT. However, the polarity of thetransistor Tr1 and the transistor Tr2 is same. In the case the anode isused as the pixel electrode and the cathode is used as the counterelectrode, it is preferable that the transistor Tr1 and the transistorTr2 are used as the p channel type TFT. In contrast, in the case theanode is used as the counter electrode and the cathode is used as thepixel electrode, it is preferable that the transistor Tr1 and thetransistor Tr2 are used as the n channel type TFT.

The maintaining capacity 105 is formed between the gate electrodes ofthe transistor Tr1 and the transistor Tr2 and the power source line Vi.Although the maintaining capacity 105 is provided for maintaining moresecurely the voltage (gate voltage) between the gate electrodes of thetransistor Tr1 and the transistor Tr2 and the source area, it is notalways necessarily provided.

The operation of the light emitting device having the pixel shown inFIG. 7 can be explained for the writing period Ta and the display periodTd as in the case of the pixel shown in FIG. 2. Furthermore, since theoperation of the pixel in the writing period Ta and the display periodTd is same as the case of the pixel shown in FIG. 2 so that theexplanation for FIG. 3 and FIG. 4 in the first embodiment can bereferred to, explanation is not given here.

Embodiment 3

In this embodiment, a configuration of the pixel 101 shown in FIG. 1different from that of FIG. 2 and FIG. 7 will be explained.

FIG. 8 shows the configuration of the pixel of this embodiment. Thepixel 101 shown in FIG. 8 has a signal line Si (one from S1 to Sx), ascanning line Gj (one from G1 to Gy), and a power source line Vi (onefrom V1 to Vx).

Moreover, the pixel 101 comprises at least a transistor Tr1 (firstcurrent driving transistor), a transistor Tr2 (second current drivingtransistor), a transistor Tr3 (first switching transistor), a transistorTr4 (second switching transistor), an OLED 104 and a maintainingcapacity 105.

The gate electrodes of the transistor Tr3 and the transistor Tr4 areboth connected with the scanning line Gj.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line Si, and the other one is connected withthe gate electrode of the transistor Tr1. Moreover, one of the sourcearea and the drain area of the transistor Tr4 is connected with thedrain area of the transistor Tr1, and the other one is connected withthe gate electrode of the transistor Tr1.

The gate electrodes of the transistor Tr1 and the transistor Tr2 areconnected with each other. Moreover, the source areas of the transistorTr1 and the transistor Tr2 are both connected with the power source lineVi.

The drain area of the transistor Tr2 is connected with a pixel electrodeof the OLED 104. The potential of the power source line Vi (power sourcepotential) is maintained at a constant level. Moreover, the potential ofthe counter electrode is maintained at a constant level as well.

The transistor Tr3 and the transistor Tr4 may either be an n channeltype TFT or a p channel type TFT. However, the polarity of thetransistor Tr3 and the transistor Tr4 is same.

Moreover, the transistor Tr1 and the transistor Tr2 may either be an nchannel type TFT or a p channel type TFT. However, the polarity of thetransistor Tr1 and the transistor Tr2 is same. In the case the anode isused as the pixel electrode and the cathode is used as the counterelectrode, it is preferable that the transistor Tr1 and the transistorTr2 are used as the p channel type TFT. In contrast, in the case theanode is used as the counter electrode and the cathode is used as thepixel electrode, it is preferable that the transistor Tr1 and thetransistor Tr2 are used as the n channel type TFT.

The maintaining capacity 105 is formed between the gate electrodes ofthe transistor Tr1 and the transistor Tr2 and the power source line Vi.Although the maintaining capacity 105 is provided for maintaining moresecurely the voltage (gate voltage) between the gate electrodes of thetransistor Tr1 and the transistor Tr2 and the source area, it is notalways necessarily provided.

The operation of the light emitting device having the pixel shown inFIG. 8 can be explained for the writing period Ta and the display periodTd as in the case of the pixel shown in FIG. 2. Furthermore, since theoperation of the pixel in the writing period Ta and the display periodTd is same as the case of the pixel shown in FIG. 2 so that theexplanation for FIG. 3 and FIG. 4 in the first embodiment can bereferred to, explanation is not given here.

EXAMPLES

Hereinafter, examples of the present invention will be explained.

Example 1

An example of a production method for a light emitting device accordingto the present invention will be explained with reference to FIGS. 9 to13. Here, a method for simultaneously producing the transistor Tr2 andthe transistor Tr4 shown in FIG. 2 and the TFT of the driving partprovided in the periphery of the pixel part will be explained in detailin according to the steps as the representative. The transistor Tr1 andthe transistor Tr3 can also be produced according to the productionmethod for the transistor Tr2 and the transistor Tr4. Moreover, thepixel shown in FIGS. 7, 8 and 30 can also be produced by the productionsteps shown in this example.

First, in this example, a substrate 900 made of a glass, such as abarium borosilicate glass, and an alumino borocilicate glass representedby #7059 glass and #1737 glass of Corning Incorporated, was used. As thesubstrate 900, any substrate having a light transmittivity can be usedso that a quarts substrate may be used as well. Moreover, a plasticsubstrate having a heat resistance durable in a process temperature ofthis example can be used as well.

Next, as shown in FIG. 9A, a base film 901 comprising an insulated film,such as a silicon oxide film, a silicon nitride film, and a siliconnitride oxide film was formed on the substrate 900. Although a two layerstructure was employed as the base film 901 in this example, a singlelayer film of the above-mentioned insulated film, or a structure withtwo or more layers laminated can be used as well. As the first layer ofthe base film 901, a silicon nitride oxide film 901 a produced by aplasma CVD method using an SiH₄, an NH₃, and an N₂O as the reaction gas,was formed by 10 to 200 nm (preferably 50 to 100 nm). In this example,the silicon nitride oxide film 901 a of a 50 nm film thickness(composition ratio Si=32%, O=27%, N=24%, H=17%) was formed. Next, as thesecond layer of the base film 901, a silicon nitride oxide film 901 bproduced by a plasma CVD method using an SiH₄, and an N₂O as thereaction gas, was formed by 50 to 200 nm (preferably 100 to 150 nm). Inthis example, the silicon nitride oxide film 901 b of a 100 nm filmthickness (composition ratio Si=32%, O=59%, N=7%, H=2%) was formed.

Next, semiconductor layers 902 to 905 were formed on the base film 901.The semiconductor layers 902 to 905 were formed by patterning into adesired shape a crystalline semiconductor film obtained by producing asemiconductor film having an amorphous structure by a known means (asputtering method, an LPCVD method, a plasma CVD method, or the like),and executing a known crystallization process (a laser crystallizationmethod, a thermal crystallization method, a thermal crystallizationmethod using a catalyst such as a nickel). The semiconductor layers 902to 905 are formed by a 25 to 80 nm (preferably 30 to 60 nm) thickness.The material for the crystalline semiconductor films is not particularlylimited, but it is formed preferably with a silicon or a silicongermanium (Si_(X)Ge_(1-X) (X=0.0001 to 0.02)) alloy. In this example,after forming a 55 nm amorphous silicon film using the plasma CVDmethod, a solution containing a nickel is maintained on the amorphoussilicon film. After executing dehydration (500° C., 1 hour) to theamorphous silicon film, a thermal crystallization (550° C., 4 hours) wasexecuted, and further, a laser annealing process was executed forimproving the crystallization was executed for forming a crystallinesilicon film. According to a patterning process of the crystallinesilicon film using a photolithography method, the semiconductor layers902 to 905 were formed.

Moreover, it is also possible to dope a slight amount of an impurityelement (boron or phosphorus) to the semiconductor layers 902 to 905after formation of the semiconductor layers 902 to 905 for controllingthe threshold value of the TFT.

Moreover, in the case of producing a crystalline semiconductor film bythe laser crystallization method, a pulse oscillation type or continuouslight emitting type excimer laser, an YAG laser, or an YVO₄ laser can beused. In the case of using these lasers, it is preferable to use amethod of linearly collecting a laser beam outputted from a laseroscillator by an optical system and directing the same to thesemiconductor films. The crystallization condition can be selectedoptionally by the operator, and in the case of using an excimer laser,the pulse oscillation frequency was set at 300 Hz, and the laser energydensity was set at 100 to 400 mJ/cm² (as the representative, 200 to 300mJ/cm²). Furthermore, in the case of using an YAG laser, it ispreferable to set the pulse oscillation frequency using the secondharmonic at 30 to 300 kHz, and the laser energy density at 300 to 600mJ/cm² (as the representative, 350 to 500 mJ/cm²). Furthermore, it ispreferable to direct a laser beam collected linearly in a 100 to 1,000μm width, for example, 400 μm to the substrate entire surface, with anoverlapping ratio of the linear laser beam at 50 to 90%.

Next, a gate insulated film 906 for covering the semiconductor layers902 to 905 was formed. The gate insulated film 906 was formed with aninsulated film containing a silicon by a 40 to 150 nm thickness usingthe plasma CVD method or the sputtering method. In this example, asilicon nitride oxide film (composition ratio Si=32%, O=59%, N=7%, H=2%)was formed by a 110 nm thickness by the plasma CVD method. Of course thegate insulated film is not limited to the silicon nitride oxide film,and a single layer or a laminated structure of an insulated filmcontaining another silicon can be adopted as well.

Moreover, in the case a silicon oxide film is used, it can be used bymixing a TEOS (tetraethyl orthosilicate) and an O₂ by the plasma CVDmethod, and executing electric discharge with a 40 Pa reaction pressure,a 300 to 400° C. substrate temperature, and a 0.5 to 0.8 W/cm² highfrequency (13.56 MHz) power density. According to the silicon oxide filmaccordingly produced, good characteristics as a gate insulated film canbe obtained by thermal annealing at 400 to 500° C. thereafter.

Then, a heat resistant conductive layer 907 for forming a gate electrodeon the gate insulated film 906 was formed by a 200 to 400 nm (preferably250 to 350 nm) thickness. The heat resistant conductive layer 907 can beformed in a single layer or as needed as a laminated structurecomprising a plurality of layers such as two layers and three layers.The heat resistant conductive layer contains an element selected fromthe group consisting of a Ta, a Ti, and a W, an alloy containing theelements as a component, or an alloy film as a combination of theelements. The heat resistant conductive layer is formed by a sputteringmethod or a CVD method. In order to achieve a low resistance, it ispreferable to reduce the concentration of a contained impurity. Inparticular, it is preferable to have the oxygen concentration of 30 ppmor less. In this example, the W film was formed by a 300 nm thickness.The W film can be formed by a sputtering method with a W used as atarget, or it can be formed also by a method using a tungstenhexafluoride (WF₆). In either case, in order to use as a gate electrode,a low resistance should be achieved, and it is preferable to have the Wfilm resistivity at 20 Ωcm or less. Although a low resistivity can beachieved in the W film by enlarging the crystal grains, in the case alarge amount of an impurity element such as an oxygen is contained inthe W, the crystallization is prohibited so as to have a highresistivity. Thereby, in the case of the sputtering method, by formingthe W film using a W target of a 99.9999% purity with sufficientattention paid for avoiding inclusion of impurities from the gas phaseat the time of film formation, a 9 to 20 μΩcm resistivity can berealized.

In contrast, in the case a Ta film is used for the heat resistantconductive layer 907, similarly, it can be formed by the sputteringmethod. For the Ta film, an Ar is used as the sputtering gas. Moreover,by adding an appropriate amount of a Xe or a Kr in the gas at the timeof sputtering, peel off of the film can be prevented by alleviating theinternal stress of the film to be formed. The resistivity of the Ta filmof an a phase is about 20 μΩcm so that it can be used as the gateelectrode, but the resistivity of the Ta film of a β phase is about 180μΩcm so that it cannot be suitable for the gate electrode. Since a TaNfilm has a crystal structure close to the α phase, by forming the TaNfilm as the base for the Ta film, the Ta film of the α phase can beobtained easily. Moreover, although it is not shown in the figure, it iseffective to form a silicon film with a phosphorus (P) doped by about a2 to 20 nm thickness below the heat resistant conductive layer 907.Thereby, improvement of the close contact property of the conductivefilm to be formed thereon and oxidation prevention can be achieved aswell as diffusion of an alkaline metal element contained in the heatresistant conductive layer 907 by a slight amount to the gate insulatedfilm 906 of the first shape can be prevented. In either case, it ispreferable to have the resistivity of the heat resistant conductivelayer 907 in a range of 10 to 50 μΩcm.

Next, a mask 908 of a resist is formed using the photolithographytechnique. Then, the first etching process is executed. In this example,it is executed with a plasma formed by using an ICP etching device, aCl₂ and a CF₄ as the etching gas, and introducing an RF (13.56 MHz)power of 3.2 W/cm² by a 1 Pa pressure. By introducing the RF (13.56 MHz)power of 224 mW/cm² also to the substrate side (specimen stage), asubstantially negative self bias voltage is applied. In this condition,the W film etching rate is about 100 nm/min. For the first etchingprocess, the time needed for just etching the W film was estimated basedon the etching rate, and the etching time increased by 20% therefrom wasset to be the etching time.

By the first etching process, conductive layers 909 to 912 having thefirst tapered shape are formed. The conductive layers 909 to 912 wereformed with the tapered part angle of 15 to 30°. In order to etchwithout leaving a residue, an over etching of increasing the etchingtime by a ratio of about 10 to 20% was applied. Since the selectionratio of the silicon nitride oxide film (gate insulated film 906) withrespect to the W film is 2 to 4 (representatively 3), the surface withthe silicon nitride oxide film exposed can be etched by about 20 to 50nm by the over etching process (FIG. 9B).

Then, by executing the first doping process, the one conductive typeimpurity element is added to the semiconductor layer. Here, an impurityelement addition step for applying the n type was executed. With themask 908 with the first shape conductive layer formed left as it is,impurity elements for providing the n type by self aligning were addedusing the conductive layers 909 to 912 having the first tapered shape bythe ion doping method. In order to add the impurity elements forproviding the n type reaching to the semiconductor layer through thetapered part at the end part of the gate electrode and the gateinsulated film 906 disposed therebelow, the dose amount is set to be1×10¹³ to 5×10¹⁴ atoms/cm², and the acceleration voltage at 80 to 160keV. As the impurity elements for providing the n type, elementsbelonging to the 15 group, typically a phosphorus (P) or an arsenic (As)can be used, but here a phosphorus was used. According to the ion dopingmethod, in the first impurity areas 914 to 914, the impurity element forproviding the n type was added in a concentration range of 1×10²⁰ to1×10²¹ atomic/cm³. (FIG. 9C)

In this step, depending on the doping condition, the impurity may beplaced below the first shape conductive layers 909 to 912 so that thefirst impurity areas 914 to 914 can be superimposed on the first shapeconductive layers 909 to 912.

Next, as shown in FIG. 9D, the second etching process is executed.Similarly, the etching process is executed with the ICP etching deviceusing a gas mixture of a CF₄ and a Cl₂ as the etching gas, a 3.2 W/cm²(13.56 MHz) RF power, a 45 mW/cm² (13.56 MHz) bias power, and a 1.0 Papressure. Thereby, conductive layers 918 to 921 having the second shapeformed by the condition can be provided. A tapered part is formed on theend part thereof, with a tapered shape with the thickness increased fromthe end part to inward. Compared with the first etching process, owingto a lower bias power applied to the substrate side, the ratio of theisotropic etching is increased so that the tapered part angle becomes 30to 60°. The end part of the mask 908 is cut by etching so as to providea mask 922. Moreover, in the step of FIG. 9D, the surface of the gateinsulated film 906 is etched by about 40 nm.

Then, the impurity element for providing the n type is doped with a doseamount smaller than that of the first doping process in a highacceleration voltage condition. For example, the operation is executedwith a 70 to 120 KeV acceleration voltage and a 1×10¹³/cm² dose amountso as to form the first impurity areas 924 to 927 having a largerimpurity concentration and the second impurity areas 928 to 931 incontact with the first impurity areas 924 to 927. In this step,depending on the doping condition, the impurity may be placed below thesecond shape conductive layers 918 to 921 so that the second impurityareas 928 to 931 can be superimposed on the second shape conductivelayers 918 to 921. The impurity concentration in the second impurityarea is set to be 1×10¹⁶ to 1×10¹⁸ atoms/cm³. (FIG. 10A)

Then, as shown in (FIG. 108), impurity areas 933 (933 a, 933 b) and 934(934 a, 934 b) of an opposite conductive type with respect to the oneconductive type are formed in the semiconductor layers 902, 905 forforming the p channel type TFT. Also in this case, by adding an impurityelement for providing the p type with the second shape conductive layers918, 921 used as a mask, an impurity area is formed by self aligning. Atthe time, the semiconductor layers 903, 904 for forming the n channeltype TFT has a resist mask 932 formed so as to cover the entire surface.The impurity areas 933, 934 formed here is formed by the ion dopingmethod using a diborane (B₂H₆). The concentration of the impurityelement for providing the p type of the impurity areas 933, 934 is setto be 2×10²⁰ to 2×10²¹ atoms/cm³.

However, the impurity areas 933, 934 can be regarded specifically as twoareas containing the impurity element for providing the n type. Thethird impurity areas 933 a, 934 a contain the impurity element forproviding the n type by a 1×10²⁰ to 1×10²¹ atoms/cm³ concentration, andthe fourth impurity areas 933 b, 934 b contain the impurity element forproviding the n type by a 1×10¹⁷ to 1×10²⁰ atoms/cm³ concentration.However, by having the concentration of the impurity element forproviding the p type of the impurity areas 933 b, 934 b at 1×10¹⁹atoms/cm³ or more, and having the concentration of the impurity elementfor providing the p type in the impurity areas 933 a, 934 a by 1.5 to 3times as much as the concentration of the impurity element for providingthe n type, any problem cannot be generated for the function as thesource area and the drain area of the p channel type TFT in the thirdimpurity area

Thereafter, as shown in FIG. 10 C, the first interlayer insulated film937 is formed on the conductive layers 918 to 921 having the secondshape and the gate insulated film 906. The first interlayer insulatedfilm 937 can be formed with a silicon oxide film, a silicon nitrideoxide film, a silicon nitride film, or a laminated film of a combinationthereof. In either case, the first interlayer insulated film 937 is madeof an inorganic insulated material. The film thickness of the firstinterlayer insulated film 937 is set to be 100 to 200 nm. In the case asilicon oxide film is used as the first interlayer insulated film 937,it can be formed by mixing a TEOS and an O₂ are the plasma CVD method,and executing electric discharge with a 40 Pa reaction pressure, a 300to 400° C. substrate temperature, and a 0.5 to 0.8 W/cm² high frequency(13.56 MHz) power density. Moreover, in the case a silicon nitride oxidefilm is used as the first interlayer insulated film 937, a siliconnitride oxide film produced from an SiH₄, an NH₃, and an N₂O, or asilicon nitride oxide film produced from an SiH₄, and an N₂O by theplasma CVD method can be used. As the production condition in this case,a 20 to 200 Pa reaction pressure, a 300 to 400° C. substratetemperature, and a 0.1 to 1.0 W/cm² high frequency (60 MHz) powerdensity can be provided. Moreover, as the first interlayer insulatedfilm 937, a hydrogenated silicon nitride oxide film produced from anSiH₄, an N₂O, and an H₂ can be adopted as well. Similarly, a siliconnitride film can be produced from an SiH₄, and an NH₃ as well.

Then, a process for activating the impurity element for providing the ntype or the p type added by each concentration is executed. This step isexecuted by the thermal annealing method using a furnace annealingfurnace. In addition thereto, the laser annealing method, or a rapidthermal annealing method (RTA method) can be adopted as well. Thethermal annealing method is executed in a nitrogen atmosphere of 1 ppmor less, preferably 0.1 ppm or less at 400 to 700° C., representatively500 to 600° C. In this embodiment a heat treatment was executed at 550°C. for 4 hours. Moreover, in the case a plastic substrate having a lowheat resistance temperature is used for the substrate 900, it ispreferable to adopt the laser annealing method.

Following the activation step, a step for hydrogenating thesemiconductor layer by executing a heat treatment at 300 to 450° C. for1 to 12 hours with the atmosphere gas changed to an atmospherecontaining 3 to 100% of a hydrogen, is executed. This is a step forfinishing the end of a dangling bond of 10¹⁶ to 10¹⁸/cm³ in thesemiconductor layer by a thermally excited hydrogen. As another meansfor the hydrogenation, the plasma hydrogenation (using a hydrogenexcited by a plasma) can be executed. In either case, it is preferableto have the defect density in the semiconductor layers 902 to 905 to10¹⁶/cm³ or less. Therefore, a hydrogen can be provided by about 0.01 to0.1 atomic %.

Then, the second interlayer insulated film 939 made of an organicinsulated material is formed by a 1.0 to 2.0 μm average thickness. Asthe organic resin material, a polyimide, an acrylic, a polyamide, apolyimide amide, a BCB (benzocyclo butene), or the like can be used. Forexample, in the case a polyimide of a type thermally polymerizable afterapplication on the substrate is used, it is formed by baking at 300° C.by a clean oven. Moreover, in the case an acrylic is used, it can beformed by using a two liquid type, mixing a main material and ahardener, applying the same on the substrate entire surface using aspinner, executing a preliminary heating operation at 80° C. for 60seconds by a hot plate, and further baking at 250° C. for 60 minutes bya clean oven.

By forming the second interlayer insulated film 939 accordingly with anorganic insulated material, the surface can be preferably flat.Moreover, since the organic resin material in general has a lowdielectric constant, the parasitic capacity can be reduced. However,since it has a moisture absorbing property and thus it is not suitableas a protection film, it can be used preferably in a combination with asilicon oxide film, a silicon nitride oxide film, a silicon nitridefilm, or the like formed as the first interlayer insulated film 937.

Thereafter, a resist mask of a predetermined pattern is formed, and acontact hole reaching to the source area or the drain area formed ineach semiconductor layer is formed. The contact hole is formed by thedry etching method. In this case, first the second interlayer insulatedfilm 939 made of an organic resin material is etched using a gas mixtureof a CF₄, an O₂, and an He as the etching gas, and then subsequently thefirst interlayer insulated film 937 is etched using a CF₄, and O₂ as theetching gas. Furthermore, in order to improve the selection ratio withrespect to the semiconductor layer, a contact hole can be formed byetching the gate electrode 906 of the third shape with the etching gaschanged to a CHF₃.

Then, source wirings 940 to 943 and drain wirings 944 to 946 are formedby forming a conductive metal film by the sputtering method or thevacuum deposition method, patterning with a mask, and etching. In thisspecification, both the source wirings and the drain wirings arereferred to as connection wirings. Although it is not shown in thefigure, in this specification, the connection wirings are formed as alaminated film of a Ti film of a 50 nm film thickness, and an alloy film(an alloy film of an Al and a Ti) of a 500 nm film thickness.

Next, a pixel electrode 947 is formed by providing a transparentconductive film thereon by a 80 to 120 nm thickness, and patterning(FIG. 11A). In this example, an indium-tin oxide (ITO) film or atransparent conductive film having 2 to 20[%] of a zinc oxide (ZnO)added to an indium oxide is used as the transparent electrode.

Moreover, the pixel electrode 947 can be connected electrically with thedrain area of the transistor Tr2 by forming the same superimposed andconnected with the drain wiring 946.

FIG. 12 is a top view of the pixel at the time of finishing the step ofFIG. 11A. In order to clarify the position of the wiring and theposition of the semiconductor layer, the insulated films and theinterlayer insulated films are omitted. The cross-sectional view takenon A-A′ in FIG. 12 corresponds with the part shown in A-A′ in FIG. 11A.

FIG. 13 is a cross-sectional view taken on B-B′ in FIG. 12. Thetransistor Tr3 has a gate electrode 975 as a part of the scanning line974, with the gate electrode 975 connected also with the gate electrode920 of the transistor Tr4. Moreover, the impurity area 977 of thesemiconductor layer of the transistor Tr3 is connected with a connectionwiring 942 serving as the signal line on one side and with the connectedwith a connection wiring 971 on the other side.

The transistor Tr1 has a gate electrode 976 as a part of the capacitywiring 973, with the gate electrode 976 connected also with the gateelectrode 921 of the transistor Tr2. Moreover, the impurity area 978 ofthe semiconductor layer of the transistor Tr1 is connected with aconnection wiring 971 on one side and with the connected with aconnection wiring 943 serving as the power source line V1 on the otherside.

The connection wiring 943 is connected also with the impurity area 934 aof the transistor Tr2. Moreover, the numeral 970 is a maintainingcapacity, having the semiconductor layer 972, the gate insulated film,906 and the capacity wiring 973. The impurity area 979 of thesemiconductor layer 972 is connected with the connection wiring 943.

Next, as shown in FIG. 11B, the third interlayer insulated film 949having an opening part at a position corresponding to the pixelelectrode 947 is formed. The third interlayer insulated film 949 havingthe insulation property serves as a bank so as to play a roll ofseparating the organic light emitting layers of the adjacent pixels. Inthis example, the third interlayer insulated film 949 is formed using aresist.

In this example, the thickness of the third interlayer insulated film949 is provided by about 1 μm, with the opening part formed in theso-called reverse tapered shape, widened toward the pixel electrode 947.This can be formed by covering except the part for forming the openingpart after film formation of the resist, exposing the same by directingthe UV light, and eliminating the exposed part by a developer.

Since the organic light emitting layers are divided for the adjacentpixels at the time of film formation of the organic light emittinglayers in the following step by having the third insulated film 949 inthe reverse tapered shape as in this example, even in the case thecoefficients of thermal expansion of the organic light emitting layersand the third interlayer insulated film 949 are different, cracking orpeel off of the organic light emitting layer can be restrained.

Although a resist film is used as the third interlayer insulated film inthis example, in some cases, a polyimide, a polyamide, an acrylic, a BCB(benzocyclo butene), a silicon oxide film, or the like can be used aswell. As long as it has the insulation property, either organic orinorganic third interlayer insulated film 949 can be used.

Next, an organic light emitting layer 950 is formed by the depositionmethod, and further, a cathode (MgAg electrode) 951 and a protectionelectrode 952 are formed by the deposition method. At the time, it ispreferable to apply a heat treatment to the pixel electrode 947 forcompletely eliminating the moisture content prior to the formation ofthe organic light emitting layer 950 and the cathode 951. Although theMgAg electrode is used as the OLED cathode in this example, anotherknown material can be used as well.

As the organic light emitting layer 950, a known material can be used.Although a two layer structure comprising a hole transporting layer anda light emitting layer is provided as the organic light emitting layerin this example, in some cases any of a hole injecting layer, anelectron injecting layer, or an electron transporting layer is provided.Accordingly, various examples of combinations have already beenreported, and any configuration can be used.

In this example, a polyphenylene vinylene is formed as the holetransporting layer by the deposition method. Moreover, as the lightemitting layer, one having 30 to 40% of a 1,3,4-oxadiazol derivativemolecularly dispersed in a polyvinyl carbazol is formed by thedeposition method, with about 1% of a coumarin 6 added as a green lightemission center.

Moreover, it is also possible to protect the organic light emittinglayer 950 from the moisture content or the oxygen by the protectionelectrode 952, but it is further preferable to provide a protection film953. IN this example, a 300 nm thickness silicon nitride film isprovided as the protection film 953. The protection film can be formedcontinuously after the protection electrode 952 without release to theatmosphere.

Moreover, the protection electrode 952 is provided for preventingdeterioration of the cathode 951, and a metal film having an aluminum asthe main component is representative thereof. Of course, anothermaterial can be used as well. Moreover, since the light emitting layer950 and the cathode 951 are extremely weak to the moisture content, itis preferable to form continuously to the protection electrode 952without release to the atmosphere for protecting the organic lightemitting layer from the outside air.

The film thickness of the organic light emitting layer 950 can beprovided by 10 to 400 [nm] (typically 60 to 150 [nm]), and the thicknessof the cathode 951 can be provided by 80 to 200 [nm] (typically 100 to150 [nm]).

Accordingly, a light emitting device having the structure shown in FIG.11B can be completed. The part 954 with the pixel electrode 947, theorganic light emitting layer 950, and the cathode 951 superimposedcorresponds to the OLED.

The p channel type TFT 960 and the n channel type TFT 961 are a TFT ofthe driving circuit, which provides a CMOS. The transistor Tr2 and thetransistor Tr4 are a TFT of the pixel part, and the TFT of the drivingcircuit and the TFT of the pixel part can be formed on the samesubstrate.

In the case of a light emitting device using an OLED, since the voltageof the power source of the driving circuit is sufficiently about 5 to6V, and about 10V at most, a problem of deterioration by the hotelectron in the TFT is not involved. Moreover, since the driving circuitneeds to be operated at a high speed, it is preferable that the TFT gatecapacity is small. Therefore, as in this example, a configuration withthe second impurity area 929 of the semiconductor layer of the TFT andthe fourth impurity area 933 b not superimposed with the gateelectrodes, 918, 919 is preferable.

The production method for a light emitting device according to thepresent invention is not limited to the production method explained inthis example, and a light emitting device of the present invention canbe produced using a known method.

Example 2

In this example, a production method for a light emitting device,different from that of the example 1 will be explained.

The steps to the formation of the second interlayer insulated film 939are same as those in the example 5. As shown in FIG. 14A, a passivationfilm 981 is formed in contact with the second interlayer film 939 afterformation of the second interlayer insulated film 981.

The passivation film 981 is effective for preventing entrance of themoisture content contained in the second interlayer insulated film 939to the organic light emitting layer 950 via the pixel electrode 947 orthe third interlayer insulated film 982. In the case the secondinterlayer insulated film 939 includes an organic resin material, sincethe organic resin material contains a large amount of the moisturecontent, it is particularly effective to provide the passivation film981.

In this example, as the passivation film 981, a silicon nitride film wasused.

Thereafter, a resist mask of a predetermined pattern is formed, and acontact hole etching to the source area or the drain area formed in eachsemiconductor layer is formed. The contact hole is formed by the dryetching method. In this case, first the passivation film 981 is etchedusing a gas mixture of a CF₄ and O₂ as the etching gas, next the secondinterlayer insulated film 939 made of an organic resin material isetched using a gas mixture of a CF₄, an O₂, and an He as the etchinggas, and then subsequently the first interlayer insulated film 937 isetched using a CF₄, and O₂ as the etching gas. Furthermore, in order toimprove the selection ratio with respect to the semiconductor layer, acontact hole can be formed by etching the gate electrode 906 of thethird shape with the etching gas changed to a CHF₃.

Then, source wirings 940 to 943 and drain wirings 944 to 946 are formedby forming a conductive metal film by the sputtering method or thevacuum deposition method, patterning with a mask, and etching. Althoughit is not shown in the figure, in this specification, the connectionwirings are formed as a laminated film of a Ti film of a 50 nm filmthickness, and an alloy film (an alloy film of an Al and a Ti) of a 500nm film thickness.

Next, a pixel electrode 947 is formed by providing a transparentconductive film thereon by a 80 to 120 nm thickness, and patterning(FIG. 14A). In this example, an indium-tin oxide (ITO) film or atransparent conductive film having 2 to 20[%] of a zinc oxide (ZnO)added to an indium oxide is used as the transparent electrode.

Moreover, the pixel electrode 947 can be connected electrically with thedrain area of the transistor Tr2 by forming the same superimposed andconnected with the drain wiring 946.

Next, as shown in FIG. 14B, the third interlayer insulated film 982having an opening part at a position corresponding to the pixelelectrode 947 is formed. In this example, a side wall of a tapered shapewas provided by using the wet etching method at the time of forming theopening part. Unlike the case of the example 1, since the organic lightemitting layer formed on the third interlayer insulated film 982 is notdivided, deterioration of the organic light emitting layer derived froma grade difference can involve a significant problem unless the sidewall of the opening part is sufficiently smooth, attention should bepaid thereto.

In this example, as the third interlayer insulated film 982, in somecases, an organic resin film made of a polyimide, a polyamide, anacrylic, BCB (benzocyclo butene), or the like can be used as well.

It is preferable to have the surface of the third interlayer insulatedfilm 982 densed by applying a plasma process using an argon on thesurface of the third interlayer insulated film 982 before forming theorganic light emitting layer on the third interlayer insulated film 982.According to the above-mentioned configuration, entrance of the moisturecontent from the third interlayer insulated film 982 to the organiclight emitting layer 950 can be prevented.

Next, an organic light emitting layer 950 is formed by the depositionmethod, and further, a cathode (MgAg electrode) 951 and a protectionelectrode 952 are formed by the deposition method. At the time, it ispreferable to apply a heat treatment to the pixel electrode 947 forcompletely eliminating the moisture content prior to the formation ofthe organic light emitting layer 950 and the cathode 951. Although theMgAg electrode is used as the OLED cathode in this example, anotherknown material can be used as well.

As the organic light emitting layer 950, a known material can be used.Although a two layer structure comprising a hole transporting layer anda light emitting layer is provided as the organic light emitting layerin this example, in some cases any of a hole injecting layer, anelectron injecting layer, or an electron transporting layer is provided.Accordingly, various examples of combinations have already beenreported, and any configuration can be used.

In this example, a polyphenylene vinylene is formed as the holetransporting layer by the deposition method. Moreover, as the lightemitting layer, one having 30 to 40% of a 1,3,4-oxadiazol derivativemolecularly dispersed in a polyvinyl carbazol is formed by thedeposition method, with about 1% of a coumarin 6 added as a green lightemission center.

Moreover, it is also possible to protect the organic light emittinglayer 950 from the moisture content or the oxygen by the protectionelectrode 952, but it is further preferable to provide a protection film953. IN this example, a 300 nm thickness silicon nitride film isprovided as the protection film 953. The protection film can be formedcontinuously without release to the atmosphere after the protectionelectrode 952.

Moreover, the protection electrode 952 is provided for preventingdeterioration of the cathode 951, and a metal film having an aluminum asthe main component is representative thereof. Of course, anothermaterial can be used as well. Moreover, since the light emitting layer950 and the cathode 951 are extremely weak to the moisture content, itis preferable to form continuously to the protection electrode 952without release to the atmosphere for protecting the organic lightemitting layer from the outside air.

The film thickness of the organic light emitting layer 950 can beprovided by 10 to 400 [nm] (typically 60 to 150 [nm]), and the thicknessof the cathode 951 can be provided by 80 to 200 [nm] (typically 100 to150 [nm]).

Accordingly, a light emitting device having the structure shown in FIG.14B can be completed. The part 954 with the pixel electrode 947, theorganic light emitting layer 950, and the cathode 951 superimposedcorresponds to the OLED.

The p channel type TFT 960 and the n channel type TFT 961 are a TFT ofthe driving circuit, which provides a CMOS. The transistor Tr2 and thetransistor Tr4 are a TFT of the pixel part, and the TFT of the drivingcircuit and the TFT of the pixel part can be formed on the samesubstrate.

The production method for a light emitting device according to thepresent invention is not limited to the production method explained inthis example, and a light emitting device of the present invention canbe produced using a known method.

Example 3

In this example, a top view of the pixel shown in FIG. 7 will beexplained. FIG. 15 is a top view of the pixel of this example. In orderto clarify the position of the wiring and the position of thesemiconductor layer, the insulated films such as the interlayerinsulated films and the gate insulated films are omitted. Moreover, thewirings formed in the same layer are shown by the same hatching.Furthermore, FIG. 15 corresponds to a top view of the pixel afterformation of the pixel electrode and before formation of the organiclight emitting layer.

The pixel shown in FIG. 15 has each one set of a scanning line 211, asignal line 210, and a power source line 217. Then, parts 212, 213 ofthe scanning line 211 each correspond to the gate electrodes of thetransistor Tr3 and the transistor Tr4.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line 210, and the other one is connected withthe drain area of the transistor Tr1 via the connection wiring 215.Moreover, one of the source area and the drain area of the transistorTr4 is connected with the drain area of the transistor Tr1 via theconnection wiring 215, and the other one is connected with the capacitywiring 216 via the connection wiring 214.

Parts 218, 220 of the capacity wiring 216 correspond to the gateelectrodes of the transistor Tr1 and the transistor Tr2. The source areaof the transistor Tr1 is connected with the power source line 217.Moreover, the source area of the transistor Tr2 is connected with thepower source line 217. Then, the drain area of the transistor Tr2 isconnected with the pixel electrode 222 via the connection wiring 221.

The numeral 219 denotes an active layer for forming a maintainingcapacity. The capacity wiring 216 is formed on the active layer 219 forforming a maintaining capacity with the gate insulated film (not shown)interposed therebetween. The part with the active layer 219 for forminga maintaining capacity, the gate insulated film, and the capacity wiring216 interposed corresponds to the maintaining capacity 205. The powersource line 217 is formed on the capacity wiring 216 with the interlayerinsulated film (not shown) interposed therebetween. The capacity formedin the part with the capacity wiring 216, the interlayer insulated film,and the power source line 217 superimposed may be used as themaintaining capacity 205.

The top view of the pixel shown in this example is merely an example ofthe configuration of the present invention, and thus the top view of thepixel shown in FIG. 7 is not limited to the configuration shown in thisexample. This example can be executed freely as a combination with theexample 1 or the example 2.

Example 4

In this example, a top view of the pixel shown in FIG. 8 will beexplained. FIG. 16 is a top view of the pixel of this example. In orderto clarify the position of the wiring and the position of thesemiconductor layer, the insulated films such as the interlayerinsulated films and the gate insulated films are omitted. Moreover, thewirings formed in the same layer are shown by the same hatching.Furthermore, FIG. 16 corresponds to a top view of the pixel afterformation of the pixel electrode and before formation of the organiclight emitting layer.

The pixel shown in FIG. 16 has each one set of a scanning line 311, asignal line 310, and a power source line 317. Then, parts 312, 313 ofthe scanning line 311 each correspond to the gate electrodes of thetransistor Tr3 and the transistor Tr4.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line 310, and the other one is connected withthe capacity wiring 316 via the connection wiring 330. Moreover, one ofthe source area and the drain area of the transistor Tr4 is connectedwith the capacity wiring 316 via the connection wiring 330, and theother one is connected with the drain area of the transistor Tr1 via theconnection wiring 315.

Parts 318, 320 of the capacity wiring 316 correspond to the gateelectrodes of the transistor Tr1 and the transistor Tr2. The source areaof the transistor Tr1 is connected with the power source line 317.Moreover, the source area of the transistor Tr2 is connected with thepower source line 317. Then, the drain area of the transistor Tr2 isconnected with the pixel electrode 322 via the connection wiring 321.

The numeral 319 denotes an active layer for forming a maintainingcapacity. The capacity wiring 316 is formed on the active layer 319 forforming a maintaining capacity with the gate insulated film (not shown)interposed therebetween. The part with the active layer 319 for forminga maintaining capacity, the gate insulated film, and the capacity wiring316 interposed corresponds to the maintaining capacity 305. The powersource line 317 is formed on the capacity wiring 316 with the interlayerinsulated film (not shown) interposed therebetween. The capacity formedin the part with the capacity wiring 316, the interlayer insulated film,and the power source line 317 superimposed may be used as themaintaining capacity 305.

The top view of the pixel shown in this example is merely an example ofthe configuration of the present invention, and thus the top view of thepixel shown in FIG. 8 is not limited to the configuration shown in thisexample. This example can be executed freely as a combination with theexample 1 or the example 2.

Example 5

In this example, a light emitting device with a configuration differentfrom that of the example 1 will be explained.

FIG. 27 is a cross-sectional view of a pixel part of the light emittingdevice according to this example. The light emitting device shown inFIG. 27 has a pixel for a red color (pixel for R) 800 r, a pixel for agreen color (pixel for G) 800 g, and a pixel for a blue color (pixel forB) 800 b. The configuration of this example can be used not only for acolor display light emitting device, but also for a light emittingdevice for displaying a monochrome image.

For the pixel of each color, the transistor Tr2 is formed on a substrate830. Although the transistors Tr1, Tr2, Tr3, Tr4 are formed for eachpixel in the light emitting device of the present invention, only thetransistor Tr2 is shown in FIG. 27.

The pixel electrodes 802 r, 802 g, 802 b (all together referred to asthe pixel electrodes 802) are each connected with the drain areas 809 r,809 g, 809 b of the transistor Tr2 via the contact hole formed in thegate insulated film 811, the first interlayer insulated film 810, andthe second interlayer insulated film 807.

In this example, the pixel electrodes are a cathode, and they to notallow the light transmission. Although an MgAg electrode is used as thecathode for the OLED in this example, another known material can be usedas well.

Then, the third interlayer insulated film 805 having an opening part ata position superimposed with the pixel electrodes 802 r, 802 g, 802 b isformed covering the pixel electrodes 802 r, 802 g, 802 b and the secondinterlayer insulated film 807. Although a silicon oxide film is used asthe third interlayer insulated film 805 in this example, in some cases,an organic resin film made of a polyimide, a polyamide, an acrylic, aBOB (benzocyclo butene), a silicon oxide film, or the like can be usedas well.

Next, at the opening part of the third interlayer insulated film 805,the organic light emitting layers 803 r, 803 g, 803 b (all togetherreferred to as the organic light emitting layers 803) are formed incontact with the pixel electrodes 802 r, 802 g, 802 b. At the time, theorganic light emitting layers 803 r, 8903 g, 803 b are formed using ametal mask by the deposition method successively per each color.Although it is conceivable that the organic light emitting layers 803 r,803 g, 803 b are formed to some extent in a part other than the openingpart of the third interlayer insulated film 805 at the time of thedeposition, they are formed only at the opening part of the thirdinterlayer insulated film 805 as much as possible.

Next, a conductive layer 806 having a metal is formed at the part otherthan the opening part in the third interlayer insulated film 805 usingthe deposition method. As the material for the conductive layer 806, ametal with a low resistance is preferable. Moreover, it is also possibleto laminate conductive layers in a plurality of layers so as to be usedas a conductive layer. Although a copper is used in this example, theconductive layer 806 material is not limited thereto, and a known metalmaterial having a resistance lower than that of the counter electrodecan be used. Since the resistance of the counter electrode to be formedlater can be lowered by forming the conductive layer 806 in thisexample, it is suitable for enlargement of the substrate.

Next, a counter electrode 804 comprising a transparent conductive filmis formed covering the organic light emitting layers 803 r, 803 g, 803 band the conductive layer 806. In this example, an ITO is used as thetransparent conductive film. The ITO can be formed by the depositionmethod. In this example, the case of forming by the ion plating methodwill be explained.

The ion plating method is one of the gas phase surface treatmenttechniques classified in the deposition method. It is a method foradhering a deposition substance evaporated by some means to a substrateby ionizing or exciting the same by a high frequency plasma or vacuumdischarge, and accelerating the ion by providing a negative potential tothe substrate to be deposited.

As the specific condition for forming the counter electrode using theion plating method, it is preferable to deposit with the substratetemperature maintained at 100 to 300° C. in a 0.01 to 1 Pa inert gasatmosphere. Furthermore, it is preferable to use the ITO as theevaporation source having a 70% or more sintering density. The optimumcondition at the time of using the ion plating method can be selectedoptionally by the operator.

Moreover, since the ionizing ratio or exciting ratio of the depositionsubstance can be improved by ionizing or exciting the depositionsubstance using the high frequency plasma as well as the ionized orexcited deposition substance is in a high energy state, it can be bondedwith the oxygen sufficiently with a high evaporation rate stillmaintained. Therefore, a good quality film can be formed at a highspeed.

In this example, the counter electrode 804 comprising a transparentconductive film was formed by a 80 to 120 nm thickness using theabove-mentioned ion plating method. In this example, an indium-tin oxide(ITO) film or a transparent conductive film having 2 to 20[%] of a zincoxide (ZnO) added to an indium oxide is used as the transparentelectrode.

The method for forming the counter electrode of this example is notlimited to the above-mentioned ion plating method. However, since thefilm formed by the ion plating method has a high close contact propertyand it can form an ITO film with a high crystallization property even ata relatively low temperature, it can lower the resistance of the ITO aswell as it can allow even film formation in a relatively wide area, andthus it is suitable for enlargement of the substrate.

In each pixel, an OLED for R 801 r, an OLED for G 801 g, and an OLED forB 801 b are completed. Each OLED has the pixel electrodes 802 r, 802 g,802 b, the organic light emitting layers 803 r, 803 g, 803 b, and thecounter electrode 804.

FIG. 28 is a top view of the substrate with the TFT formed (elementsubstrate) of this example. It shows the state with the pixel part 831,the scanning line driving circuit 832, the signal line driving circuit833, and the terminal 834 formed in the substrate 830. The terminal 834and each driving circuit, and the power source line formed in the pixelpart and the counter electrode are connected by a lead wiring 835.

Moreover, as needed, an IC chip with a CPU, a memory, or the likeformed, can be mounted on the element substrate by the COG (chip onglass) method, or the like.

The OLED is formed between the conductive layers 806. The structurethereof is shown in FIG. 29. The pixel electrode 802 is an electrodecorresponding to each pixel, formed between the conductive layers 806.In the upper layer thereof, an organic compound layer 803 is formedbetween the conductive layers 806, continuously in a stripe-like formacross a plurality of the pixel electrodes 802.

The counter electrode is formed in the upper layer of the organiccompound layer 803 and the conductive layer 806 such that it is also incontact with the conductive layer 806.

The lead line 835 is formed in the same layer as the scanning line (notshown) without direct contact with the conductive layer 806. Then, thelead line 835 and the counter electrode 804 has the contact in thesuperimposed part.

The configuration of this example can be executed freely as acombination with the example 3 or 4.

Example 6

In this example, the configuration of driving circuits (a signal drivingcircuit and a scanning line driving circuit) of a light emitting devicedriven by a digital driving method of the present invention.

FIG. 17 is a block diagram showing the configuration of a signal linedriving circuit 601. The numeral 602 is a shift resistor, the numeral603 a memory circuit A, the numeral 604 a memory circuit B, and thenumeral 605 a constant current circuit.

To the shift resistor 602, a clock signal CLK and a start pulse signalSP are inputted. Moreover, to the memory circuit A 603, a digital videosignal is inputted. And to the memory circuit B 604, a latch signal isinputted. A constant signal current Ic outputted from the constantcurrent circuit 604 is inputted to the signal line.

FIG. 18 shows a further detailed configuration of the signal linedriving circuit 601.

According to the input of the clock signal CLK and the start pulsesignal SP from a predetermined wiring to the shift resistor 602, atiming signal is produced. The timing signal is inputted each to aplurality of latches A (LATA-1 to LATA-x) of the memory circuit A 603.At the time, it is also possible to input the timing signal produced bythe shift resistor 602 each to a plurality of the latches A (LATA-1 toLATA-x) of the memory circuit A 603 after buffer amplification by abuffer, or the like.

In the case the timing signal is inputted to the memory circuit A 603, adigital video signal for one bit to be inputted to the video signal line610 is written successively to each of the plurality of the latches A(LATA-1 to LATA-x) synchronously with the timing signal so as to bestored.

Although the digital video signal is inputted successively to theplurality of the latches A (LATA-1 to LATA-x) of the memory circuit A603 at the time of taking the digital video signal to the memory circuitA 603 in this embodiment, the present invention is not limited to thisconfiguration. It is also possible to execute the so-called divideddrive of driving latches of a plurality of stages of the memory circuitA 603 into several stages, and inputting a digital video signalsimultaneously for each group. The number of the groups at the time iscalled the division number. For example, in the case latches are dividedinto groups for 4 stages, it is called the four division divided drive.

The time needed for finishing each writing operation of a digital videosignal to the latches of all the stages of the memory circuit A 603 iscalled the line period. In the real situation, the period with thehorizontal retrace line period added to the line period may be referredto as the line period.

In the case one line period is finished, a latch signal is supplied to aplurality of latches B (LATB-1 to LATB-x) of the memory circuit B 604via the latch signal line 609. At the moment, the digital video signalsstored in the plurality of the latches A (LATA-1 to LATA-x) of thememory circuit A 603 are written and stored in the plurality of thelatches B (LATB-1 to LATB-x) of the memory circuit B 604 all together.

A digital video signal for the next one bit is written in the memorycircuit A 603 after sending out the digital video signals to the memorycircuit B 604, based on the timing signal from the shift registor 602successively.

In the second one line period, the digital video signals written andstored in the memory circuit B 604 are inputted to the constant currentcircuit 605.

The constant current circuit 605 has a plurality of current settingcircuits (C1 to Cx). In the case a digital video signal is inputted toeach of the current setting circuits (C1 to Cx), based on theinformation of 1 or 0 of the digital video signal, either supply of aconstant current Ic in the signal line, or application of a potential ofthe power source lines V1 to Vx to the signal line, is selected.

FIG. 19 shows an example of a specific configuration of the currentsetting circuit C1. The current setting circuits C2 to Cx have the sameconfiguration.

The current setting circuit C1 has a constant current source 631, fourtransmission gates SW1 to SW4, and two inverters Inb1, Inb2. Thepolarity of the transistor 650 of the constant current source 631 issame as the polarity of the transistors Tr1 and Tr2 of the pixel.

According to the digital video signal outputted from the LATB-1 of thememory circuit B 604, the switching operation of SW1 to SW4 iscontrolled. The digital video signals inputted to SW1 and SW3 and thedigital video signals inputted to SW2 and SW4 are inverted by Inb1,Inb2. Therefore, in the case SW1 and SW3 are on, SW2 and SW4 are off,and in the case SW1 and SW3 are off, SW2 and SW4 are on.

In the case SW1 and SW3 are on, a current Ic of a predetermined valueexcept 0 is inputted from the constant current source 631 to the signalline S1 via SW1 and SW3.

In contrast, in the case SW2 and SW4 are on, the current Ic from theconstant current source 631 is provided to the ground via SW2. Moreover,the power source potential from the power source lines V1 to Vx isprovided to the signal line S1 via SW4 so as to be Ic≈0.

With reference to FIG. 18, the above-mentioned operation is executedsimultaneously in a one line period for all the current setting circuits(C1 to Cx) of the constant current circuit 605. Therefore, the value ofthe signal current Ic inputted to all the signal lines is selected bythe digital video signals.

Next, the configuration of the scanning line driving circuit will beexplained.

FIG. 20 is a block diagram showing the configuration of the scanningline driving circuit 641.

The scanning line driving circuit 641 each has a shift registor 642, anda buffer 643. In some cases, a level shifter may be provided as well.

In the scanning line driving circuit 641, by inputting the clock CLK andthe start pulse signal SP to the shift registor, a timing signal isproduced. The produced timing signal is buffer-amplified by the buffer643 so as to be supplied to a corresponding scanning line.

The scanning line is connected with the gate electrodes of the firstswitching TFT and the second switching TFT for a pixel of one line.Since the first switching TFT and the second switching TFT for a pixelof one line should be switched on simultaneously, one capable ofsupplying a large amount of the current is used as the buffer 643.

The driving circuit used in the present invention is not limited to theconfiguration shown in this example. The constant current circuit shownin this example is not limited to the configuration shown in FIG. 19.The constant current circuit used in the present invention can have anyconfiguration as long as either one of the binary of the signal currentIc can be selected by the digital video signal, and the signal currentof the selected value can be provided to the signal line.

The configuration of this example can be executed freely as acombination with the examples 1 to 5.

Example 7

In this example, the order of appearance of the sub frame periods SF1 toSFn in the driving method for a light emitting device according to thepresent invention corresponding to a digital video signal of n bits willbe explained.

FIG. 21 shows a timing n sets of writing periods (Ta1 to Tan) and n setsof display periods (Td1 to Tdn) appearing in one frame period. Thelateral axis represents the time and the vertical axis represents theposition of the scanning line of the pixel. As to the detailed operationof each pixel, the embodiments can be referred to, and thus it isomitted here.

In the driving method of this example, the sub frame period (in thisexample, SFn) having the longest display period in the one frame periodis not provided at the first and the last of the one frame period. Inother words, another sub frame period contained in the same frame periodappears before and after the sub frame period having the longest displayperiod in the one frame period.

According to the above-mentioned configuration, display irregularityderived from the successive arrangement of the display periods faremitting a light in the adjacent frame periods in the middle gradientdisplay can hardly be recognized by human eyes.

The configuration of this example is effective in the case of n≧3.Moreover, the configuration of this example can be executed freely as acombination with the examples 1 to 6.

Example 8

In this example, an example of driving the light emitting device of thepresent invention using a digital video signal of 6 bits will beexplained.

FIG. 22 shows a timing of 6 sets of writing periods (Ta1 to Ta6) and 6sets of display periods (Td1 to Td6) appearing in one frame period. Thelateral axis represents the time and the vertical axis represents theposition of the scanning line of the pixel. As to the detailed operationof each pixel, the embodiments can be referred to, and thus it isomitted here.

In the case of the drive using a digital video signal of 6 bits, atleast 6 sets of sub frame periods SF1 to SF6 are provided in the oneframe period.

The sub frame periods SF1 to SF6 correspond to each bit of the digitalsignal of 6 bits. The sub frame periods SF1 to SF6 have 6 sets of thewriting periods (Ta1 to Ta6) and 6 sets of the display periods (Td1 toTd6).

The sub frame period having the writing period Tam and the displayperiod Tdm corresponding to the m-th bit (m is an optional number of 1to 6) is SFm. After the writing period Tam, the display periodcorresponding to the same bit number, in this case, Tdm appears.

By repeated appearance of the writing period Ta and the display periodTd in the one frame period, an image can be displayed.

The length of the display periods SF1 to SF6 satisfies SF1:SF2: . . .:SF6=2⁰:2¹: . . . :2⁵.

According to the driving method of the present invention, the gradientis displayed by controlling the sum of the length of the display periodwith the light emission in the one frame period.

The configuration of this example can be executed freely as acombination with the examples 1 to 7.

Example 9

In this example, an example of the driving method using a digital videosignal of n bits, which is different from that of FIG. 6 and FIG. 21.

FIG. 23 shows a timing of n+1 sets of writing periods (Ta1 to Ta(n+1))and n+1 sets of display periods (Td1 to Td(n+1)) appearing in one frameperiod. The lateral axis represents the time and the vertical axisrepresents the position of the scanning line of the pixel. As to thedetailed operation of each pixel, the embodiments can be referred to,and thus it is omitted here.

In this example, corresponding to the n bit digital video signal, n+1sets of sub frame periods SF1 to SFn+1 are provided in the one frameperiod. Then, the sub frame periods SF1 to SFn+1 have n+1 sets of thewriting periods (Ta1 to Ta(n+1)) and n+1 sets of the display periods(Td1 to Td(n+1)).

The sub frame period having the writing period Tam and the displayperiod Tdm (m is an optional number of 1 to n+1) is SFm. After thewriting period Tam, the display period corresponding to the same bitnumber, in this case, Tdm appears.

The sub frame periods SF1 To SFn−1 correspond to each bit of the digitalsignal of 1 to (n−1) bits. The sub frame periods SFn and SF(n+1)correspond to the digital video signal of the n-th bit.

Moreover, in this example, the sub frame periods SFn and SF(n+1)corresponding to the digital video signal of the same bit do not appearcontinuously. In other words, another sub frame period is providedbetween the sub frame periods SFn and SF(n+1) corresponding to thedigital video signal of the same bit.

By repeated appearance of the writing period Ta and the display periodTd in the one frame period, an image can be displayed.

The length of the display periods SF1 to SFn+1 satisfies SF1:SF2: . . .:(SFn+SF(n+1))=2⁰: 2¹: . . . :2^((n−1)).

According to the driving method of the present invention, the gradientis displayed by controlling the sum of the length of the display periodwith the light emission in the one frame period.

In this example, according to the above-mentioned configuration, displayirregularity derived from the successive arrangement of the displayperiods for emitting a light in the adjacent frame periods in the middlegradient display can hardly be recognized by human eyes.

Although the case with two sub frame periods corresponding to the samebit has been explained in this example, the present invention is notlimited thereto. Sub frame periods corresponding to the same bit in oneframe period can be provided three or more.

Moreover, although a plurality of sub frame periods corresponding to thedigital video signal of the uppermost position bit have been provided inthis example, the present invention is not limited thereto. Sub frameperiods corresponding to a digital video signal of a bit other than thebit of the uppermost position can be provided in a plurality.Furthermore, the bit provided with a plurality of the corresponding subframe periods is not limited to one, and a configuration having aplurality of sub frame periods each to several bits can be adopted aswell.

The configuration of this example is effective in the case of n≧2.Moreover, the configuration of this example can be executed freely as acombination with the examples 1 to 8.

Example 10

In this example, the configuration of a signal line driving circuit of alight emitting device according to the present invention driven by ananalog driving method will be explained. As to the configuration of thescanning line driving circuit, one described in the example 6 can beadopted, explanation is omitted here.

FIG. 31A is a block diagram of a signal line driving circuit 401 of thisexample. The numeral 402 is a shift resistor, the numeral 403 a buffer,the numeral 404 a sampling circuit, and the numeral 405 is a currentconverting circuit.

To the shift register 402, a clock signal (CLK), and a start pulsesignal (SP) are inputted. In the case the clock signal (CLK) and thestart pulse signal (SP) are inputted to the shift resistor 402, a timingsignal is produced.

The produced timing signal is amplified or buffer-amplified by thebuffer 403 so as to be inputted to the sampling circuit 404. Moreover,the timing signal can be amplified by providing a level shifter insteadof the buffer. Furthermore, both the buffer and the level shifter can beprovided.

FIG. 31B shows a specific configuration of the sampling circuit 404 andthe current converting circuit 405. The sampling circuit 404 isconnected with the buffer 403 at the terminal 410.

The sampling circuit 404 is provided with a plurality of switches 411.Furthermore, an analog video signal is inputted from the video signalline 406 to the sampling circuit 404. The switch 411 samples the analogvideo signal synchronously with the timing signal so as to input thesame to the current converting circuit 405 in the later stage. AlthoughFIG. 31B shows only the configuration of the current converting circuit405 connected with one of the switches 411 of the sampling circuit 404,the current converting circuit 405 as shown in FIG. 31B is connected inthe later stage of each switch 411.

Although only one transistor is used for the switch 411 in this example,any switch capable of sampling the analog video signal synchronouslywith the timing signal can be adopted as the switch 411, and thus it isnot limited to the configuration of this example.

The sampled analog video signal is inputted to a current output circuit412 of the current converting circuit 405. The current output circuit412 outputs a current (signal current) of a value corresponding to thevoltage of the inputted video signal. Although a current output circuitis provided using an amplifier and a TFT in FIG. 31, the presentinvention is not limited to the configuration, and any circuit capableof outputting the current of a value corresponding to the voltage of theinputted signal can be adopted.

The signal current is inputted to a reset circuit 417 of the currentconverting circuit 405. The reset circuit has two analog switches 413,414, an inverter 416, and a power source 415.

A reset signal (Res) is inputted to the analog switch 414, and a resetsignal (Res) inverted by the inverter 416 is inputted to the analogswitch 413. Then, the analog switch 413 and the analog switch 414 areoperated synchronously each with the inverted reset signal and the resetsignal such that when one is on, the other is off.

In the case the analog switch 413 is on, the signal current is inputtedto the corresponding signal line. In contrast, in the case the analogswitch 414 is on, the potential of the power source 415 is provided tothe signal line so that the signal line is reset. It is preferable thatthe potential of the power source 415 is at substantially same height asthe potential of the power source line provided to the pixel. And thecurrent supplied to the signal line when the signal line is reset ispreferably close to 0 as much as possible.

It is preferable that the signal line is reset in the retrace lineperiod. However, it is possible to reset in a period other than theretrace line period as needed as long as it is not a period showing animage.

The configuration of the signal line driving circuit and the scanningline driving circuit for driving the light emitting device of thepresent invention is not limited to that shown in this example. Theconfiguration of this example can be executed freely as a combinationwith the examples 1 to 9.

Example 11

In this example, by using an organic light emitting material capable ofutilizing the phosphorescence from a triplet exciton to the lightemission, the external light emission quantum efficiency candramatically be improved. Thereby, a low power consumption, a long life,and a light weight of the OLED can be achieved.

Here, a report of improvement of the external light emission quantumefficiency utilizing the triplet exciton will be shown. (T. Tsutsui, C.Adachi, S. Saito, Photochemical Processes In organized MolecularSystems, ed. K. Honda, (Elsevier Sci. Pub., Tokyo, 1991) p. 437.)

A molecular formula of the organic light emitting material (coumarinpigment) reported in the above-mentioned article is shown below.

-   (M. A. Baldo, D., F. O'Brien, Y. You, A. Shoustikov, S.    Sibley, M. E. Thompson, S. R. Forrest, Nature 395 (1998) p. 151.)

A molecular formula of the organic light emitting material (Pt complex)reported in the above-mentioned article is shown below.

-   (M. A. Baldo, S. Lamansky, P. E. Burrrows, M. E. Thompson, S. R.    Forrest, Appl. Phys. Lett., 75 (1999) p. 4.) (T. Tsutsui, M.    J.-Yang, M. Yahiro, K. Nakamura, T. Watanabe, T. Tsuji, Y.    Fukuda, T. Wakimoto, S. Mayaguchi, Jpn. Appl. Phys., 38 (12B) (1999)    L1502.)

A molecular formula of the organic light emitting material (Ir complex)reported in the above-mentioned article is shown below.

In the case the phosphorescence light emission from the triplet excitorcan be utilized as mentioned above, in principle, a high external lightemission quantum efficiency three to four times as much as the case ofutilizing the fluorescence light emission from a singlet excitor can berealized.

The configuration of this example can be executed freely as acombination with any of the examples 1 to 10.

Example 12

An example of producing a light emitting device using the presentinvention will be explained in this example with reference to FIG. 24.

FIG. 24 is a top view of a light emitting device formed by sealing theelement substrate with the TFT formed by a sealing material. FIG. 24B isa cross-sectional view taken on the line A-A′ in FIG. 24A, and FIG. 24Cis a cross-sectional view taken on the line B-B′ of FIG. 24A.

A sealing material 4009 is provided surrounding a pixel part 4002provided on a substrate 4001, a signal line driving circuit 4003, andfirst and second scanning line driving circuits 4004 a, b. Moreover, asealing material 4008 is provided on the pixel part 4002, the signalline driving circuit 4003, and the first and second scanning linedriving circuits 4004 a, b. Accordingly, the signal pixel part 4002, thesignal line driving circuit 4003, and the first and second scanning linedriving circuits 4004 a, b are sealed in a filling material 4210 by thesubstrate 4001, the sealing material 4009 and the sealing material 4008.

Moreover, the pixel part 4002 provided on the substrate 4001, the signalline driving circuit 4003, and the first and second scanning linedriving circuits 4004 a, b have a plurality of TFTs. FIG. 24B showsrepresentatively a driving TFT included in the signal line drivingcircuit 4003, formed on the base film 4010 (here, the n channel type TFTand the p channel TFT) 4201, and a current controlling TFT (transistorTr2) included in the pixel part 4002.

In this example, the p channel type TFT or the n channel TFT produced bya known method is used for the driving TFT 4201, and a p channel typeTFT produced by a known method is used for the current controlling TFT4202. Moreover, the pixel part 4002 is provided with a maintainingcapacity (not shown) connected with the gate of the current controllingTFT 4202.

An interlayer insulated film (flattening film) 4301 is formed on thedriving TFT 4201 and the current controlling TFT 4202, with a pixelelectrode (anode) 4203 electrically connected with the drain of thecurrent controlling TFT 4202 formed thereon. As the pixel electrode4203, a transparent conductive film having a large work function isused. As the transparent conductive film, a compound of an indium oxideand a tin oxide, a compound of an indium oxide and a zinc oxide, a zincoxide, or an indium oxide can be used. Moreover, the above-mentionedtransparent conductive film with a gallium added can be used as well.

Furthermore, the insulated film 4302 is formed on the pixel electrode4203, and the insulated film 4302 has an opening part formed on thepixel electrode 4203. At the opening part, an organic light emittinglayer 4204 is formed on the pixel electrode 4203. For the organic lightemitting layer 4204, a known organic light emitting material orinorganic light emitting material can be used. Moreover, the organiclight emitting material includes both a low molecular type (monomertype) and high molecular type (polymer type) materials, and either onecan be used.

As to the method for forming the organic light emitting layer 4204, aknown deposition technique or application method technique can be used.Moreover, as to the organic light emitting layer structure, a laminatedstructure or a single layer structure provided by a free combination ofa hole injecting layer, a positive hole transporting layer, a lightemitting layer, an electron transporting layer, and an electroninjecting layer.

A cathode 4205 made of a conductive film having the light blockingproperty (representatively a conductive film containing as the maincomponent an aluminum, a copper, or a silver, or a laminated film ofthem and another conductive film) is formed on the organic lightemitting layer 4204. Moreover, it is preferable to exclude the moisturecontent or the oxygen existing on the interface between the cathode 4205and the organic light emitting layer 4204 as much as possible.Therefore, a scheme of forming the organic light emitting layer 4204with a nitrogen or a rare gas atmosphere so that the cathode 4205 can beformed without contact with the oxygen or the moisture content, isnecessary. In this example, the above-mentioned film formation isenabled by using a multi chamber method (cluster tool method) filmforming device. A predetermined voltage is applied to the cathode 4205.

As mentioned above, the OLED 4303 comprising the pixel electrode (anode)4203, the organic light emitting layer 4204, and the cathode 4205 can beformed. Furthermore, a protection film 4303 is formed on the insulatedfilm 4302 so as to cover the OLED 4303. The protection film 4303 iseffective for preventing entrance of the oxygen, the moisture content,or the like to the OLED 4303.

The numeral 4005 a is a lead wiring connected with the power sourcesupply line, connected electrically with the source area of the currentcontrolling TFT 4202. The lead line 4005 a disposed between the sealingmaterial 4009 and the substrate 4001 is connected electrically with theFPC wiring 4301 of the FPC 4006 via the anisotropic conductive film4300.

For the sealing material 4008, a glass material, a metal material(representatively, a stainless steel material), a ceramic material, or aplastic material (including a plastic film) can be used. For the plasticmaterial, an FRP (fiberglass-reinforced plastics) plate, a PVF(polyvinyl fluoride) film, a Mylar film, a polyester film, or an acrylicresin film can be used. Moreover, a sheet with a structure with analuminum foil interposed by PVF films or Mylar films can be used aswell.

However, in the case the light radiation direction from the OLED istoward the cover material side, the cover material should betransparent. In this case, a transparent substance, such as a glassplate, a plastic plate, a polyester film, or an acrylic film is used.

Moreover, for the filling material 4210, in addition to an inert gassuch as a nitrogen and an argon, an ultraviolet ray hardening resin or athermosetting resin can be used. Examples thereof include a PVC(polyvinyl chloride), an acrylic, a polyimide, an epoxy resin, a siliconresin, a PVB (polyvinyl butylal), or an EVA (ethylene vinyl acetate). Inthis example, as the filling material, a nitrogen was used.

Furthermore, in order to expose the filling material 4210 to a moistureabsorbing substance (preferably a barium oxide) or a substance capableof adsorbing the oxygen, a recess part 4007 is provided in the sealingmaterial 4008 on the substrate 4001 side for disposing a moistureabsorbing substance or a substance capable of absorbing the oxygen 4207.Then, in order to prevent scattering of the moisture absorbing substanceor the substance capable of absorbing the oxygen 4207, the moistureabsorbing substance or the substance capable of absorbing the oxygen4207 is kept in the recess part 4007 by a recess part cover material4208. The recess part cover material 4208 has a fine mesh-like shapesuch that passage of the air or the moisture content is allowed butpassage of the moisture absorbing substance or the substance capable ofabsorbing the oxygen 4207 is not allowed. By providing the moistureabsorbing substance or the substance capable of absorbing the oxygen4207, deterioration of the OLED 4303 can be restrained.

As shown in FIG. 24C, simultaneously with the formation of the pixelelectrode 4203, a conductive film 4203 a is formed in contact with thelead wiring 4005 a.

Moreover, the anisotropic film 4300 has a conductive filler 4300 a. Bythermally pressing the substrate 400Y and the FPC 4006, the conductivefilm 4203 a on the substrate 4001 and the wiring for the FPC 4301 on theFPC 4006 can be connected electrically by the conductive filler 4300 a.

The configuration of this example can be executed freely as acombination with any of the examples 1 to 11.

Example 13

In this example, an example of the configuration of the pixel of thelight emitting device of the present invention different from that ofFIG. 2, 7, or 8 will be explained.

FIG. 30A shows the configuration of the pixel of this example. The pixel701 shown in FIG. 30A has a signal line Si (one of the S1 to Sx), thefirst scanning line Gaj (one of the Ga1 to Gay), the second scanningline Gbj (one of the Gb1 to Gby), and a power source line Vi (one of theV1 to Vx). The number of the first scanning lines and the secondscanning lines provided in the pixel part need not to be always the samenumber.

Moreover, the pixel 701 has at least a transistor Tr1 (the first currentdriving transistor or the first transistor), a transistor Tr2 (thesecond current driving transistor or the second transistor), atransistor Tr3 (first switching transistor or the third transistor), atransistor Tr4 (second switching transistor or the fourth transistor), atransistor Tr5 (transistor for erasure, or the fifth transistor), anOLED 704 and a maintaining capacity 705.

The gate electrodes of the transistor Tr3 and the transistor Tr4 areboth connected with the first scanning line Gaj.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line Si, and the other one is connected withthe drain area of the transistor Tr1. Moreover, one of the source areaand the drain area of the transistor Tr4 is connected with the signalline Si, and the other one is connected with the gate electrode of thetransistor Tr1.

The gate electrodes of the transistor Tr1 and the transistor Tr2 areconnected with each other. Moreover, the source areas of the transistorTr1 and the transistor Tr2 are both connected with the power source lineVi.

The drain area of the transistor Tr2 is connected with a pixel electrodeof the OLED 704.

The gate electrode of the transistor Tr5 is connected with the secondscanning line Gbj. Moreover, one of the source area and the drain areaof the transistor Tr5 is connected with the power source line Vi, andthe other one is connected with the gate electrodes of the transistorTr1 and the transistor Tr2.

The potential of the power source line Vi (power source potential) ismaintained at a constant level. Moreover, the potential of the counterelectrode is maintained at a constant level as well.

The transistor Tr3 and the transistor Tr4 may either be an n channeltype TFT or a p channel type TFT. However, the polarity of thetransistor Tr3 and the transistor Tr4 is same.

Moreover, the transistor Tr1 and the transistor Tr2 may either be an nchannel type TFT or a p channel type TFT. However, the polarity of thetransistor Tr1 and the transistor Tr2 is same. In the case the anode isused as the pixel electrode and the cathode is used as the counterelectrode, the transistor Tr1 and the transistor Tr2 are used as the pchannel type TFT. In contrast, in the case the anode is used as thecounter electrode and the cathode is used as the pixel electrode, thetransistor Tr1 and the transistor Tr2 are used as the n channel typeTFT.

Moreover, the transistor Tr5 may either be the n channel type TFT or thep channel type TFT.

The maintaining capacity 705 is formed between the gate electrodes ofthe transistor Tr1 and the transistor Tr2 and the power source line Vi.Although the maintaining capacity 705 is provided for maintaining moresecurely the voltage (gate voltage) between the gate electrodes of thetransistor Tr1 and the transistor Tr2 and the source area, it is notalways necessarily provided.

FIG. 30B shows another configuration of the pixel of this example. Thepixel 711 shown in FIG. 30B has a signal line Si (one of the S1 to Sx),the first scanning line Gaj (one of the Ga1 to Gay), the second scanningline Gbj (one of the Gb1 to Gby), and a power source line Vi (one of theV1 to Vx).

Moreover, the pixel 711 has at least a transistor Tr1 (the first currentdriving transistor), a transistor Tr2 (the second current drivingtransistor), a transistor Tr3 (first switching transistor), a transistorTr4 (second switching transistor), a transistor Tr5 (transistor forerasure, or the fifth transistor), an OLED 714 and a maintainingcapacity 715.

The gate electrodes of the transistor Tr3 and the transistor Tr4 areboth connected with the first scanning line Gaj.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line Si, and the other one is connected withthe drain area of the transistor Tr1. Moreover, one of the source areaand the drain area of the transistor Tr4 is connected with the drainarea of the transistor Tr1, and the other one is connected with the gateelectrode of the transistor Tr1.

The gate electrodes of the transistor Tr1 and the transistor Tr2 areconnected with each other. Moreover, the source areas of the transistorTr1 and the transistor Tr2 are both connected with the power source lineVi.

The drain area of the transistor Tr2 is connected with a pixel electrodeof the OLED 714. The potential of the power source line Vi (power sourcepotential) is maintained at a constant level. Moreover, the potential ofthe counter electrode is maintained at a constant level as well.

The gate electrode of the transistor Tr5 is connected with the secondscanning line Gbj. Moreover, one of the source area and the drain areaof the transistor Tr5 is connected with the power source line Vi, andthe other one is connected with the gate electrodes of the transistorTr1 and the transistor Tr2.

The transistor Tr3 and the transistor Tr4 may either be an n channeltype TFT or a p channel type TFT. However, the polarity of thetransistor Tr3 and the transistor Tr4 is same.

Moreover, the transistor Tr1 and the transistor Tr2 may either be an nchannel type TFT or a p channel type TFT. However, the polarity of thetransistor Tr1 and the transistor Tr2 is same. In the case the anode isused as the pixel electrode and the cathode is used as the counterelectrode, it is preferable that the transistor Tr1 and the transistorTr2 are used as the p channel type TFT. In contrast, in the case theanode is used as the counter electrode and the cathode is used as thepixel electrode, it is preferable that the transistor Tr1 and thetransistor Tr2 are used as the n channel type TFT.

Moreover, the transistor Tr5 may either be the n channel type TFT or thep channel type TFT.

The maintaining capacity 715 is formed between the gate electrodes ofthe transistor Tr1 and the transistor Tr2 and the power source line Vi.Although the maintaining capacity 715 is provided for maintaining moresecurely the voltage (gate voltage) between the gate electrodes of thetransistor Tr1 and the transistor Tr2 and the source area, it is notalways necessarily provided.

FIG. 30C shows another configuration of the pixel of this example. Thepixel 721 shown in FIG. 30C has a signal line Si (one of the S1 to Sx),the first scanning line Gaj (one of the Ga1 to Gay), the second scanningline Gbj (one of the Gb1 to Gby) and a power source line Vi (one of theV1 to Vx). Moreover, the pixel 721 has at least a transistor Tr1 (thefirst current driving transistor), a transistor Tr2 (the second currentdriving transistor), a transistor Tr3 (first switching transistor), atransistor Tr4 (second switching transistor), a transistor Tr5(transistor for erasure, or the fifth transistor), an OLED 724 and amaintaining capacity 725.

The gate electrodes of the transistor Tr3 and the transistor Tr4 areboth connected with the first scanning line Gaj.

One of the source area and the drain area of the transistor Tr3 isconnected with the signal line Si, and the other one is connected withthe gate electrode of the transistor Tr1. Moreover, one of the sourcearea and the drain area of the transistor Tr4 is connected with thedrain area of the transistor Tr1, and the other one is connected withthe gate electrode of the transistor Tr1.

The gate electrodes of the transistor Tr1 and the transistor Tr2 areconnected with each other. Moreover, the source areas of the transistorTr1 and the transistor Tr2 are both connected with the power source lineVi.

The drain area of the transistor Tr2 is connected with a pixel electrodeof the OLED 724. The potential of the power source line Vi (power sourcepotential) is maintained at a constant level. Moreover, the potential ofthe counter electrode is maintained at a constant level as well.

The gate electrode of the transistor Tr5 is connected with the secondscanning line Gbj. Moreover, one of the source area and the drain areaof the transistor Tr5 is connected with the power source line Vi, andthe other one is connected with the gate electrodes of the transistorTr1 and the transistor Tr2.

The transistor Tr3 and the transistor Tr4 may either be an n channeltype TFT or a p channel type TFT. However, the polarity of thetransistor Tr3 and the transistor Tr4 is same.

Moreover, the transistor Tr1 and the transistor Tr2 may either be an nchannel type TFT or a p channel type TFT. However, the polarity of thetransistor Tr1 and the transistor Tr2 is same. In the case the anode isused as the pixel electrode and the cathode is used as the counterelectrode, it is preferable that the transistor Tr1 and the transistorTr2 are used as the p channel type TFT. In contrast, in the case theanode is used as the counter electrode and the cathode is used as thepixel electrode, it is preferable that the transistor Tr1 and thetransistor Tr2 are used as the n channel type TFT.

Moreover, the transistor Tr5 may either be the n channel type TFT or thep channel type TFT.

The maintaining capacity 725 is formed between the gate electrodes ofthe transistor Tr1 and the transistor Tr2 and the power source line Vi.Although the maintaining capacity 725 is provided for maintaining moresecurely the voltage (gate voltage) between the gate electrodes of thetransistor Tr1 and the transistor Tr2 and the source area, it is notalways necessarily provided.

The driving method for a light emitting device having a pixel, shown inFIGS. 30A, 30B, 30C is limited only to the digital driving method.Furthermore, in the pixel shown in FIGS. 30A, 30B, 30C, by switching onthe transistor Tr5 by controlling the potential of the second scanningline Gbj when the OLED 704, 714, 724 is emitting a light, the OLED 704,714, 724 can be in a non-light emitting state. Therefore, since thedisplay period of each pixel can be finished forcibly simultaneouslywith the input of the digital video signal to the pixel, the displayperiod can be made shorter than the writing period so that it issuitable for driving with a digital video signal of a high bit number.

The configuration of this example can be executed freely as acombination with the configuration shown in the examples 1, 2, 5, 5, 7,8, 9, 11, 12.

Example 14

Since the light emitting device using the OLED is a spontaneous lightemitting type, compared with a liquid crystal display, it has a superiorvisibility in a bright place, and a wide view angle. Therefore, it canbe used for the display part of various kinds of electronic appliances.

As the electronic appliances using the light emitting device of thepresent invention, a video camera, a digital camera, a goggle typedisplay (head mount display) a navigation system, a sound reproducingdevice (car audio, audio component, or the like), a lap top typepersonal computer, a game appliance, a portable information terminal(mobile computer, portable phone, portable type game machine, electronicbook, or the like), an image reproducing device comprising a memorymedium (specifically, a device for reproducing a memory medium such as aDVD: digital versatile disc, or the like, comprising a display fordisplaying the image), or the like, can be presented. In particular,since the width of the view angle is important for portable informationterminal with a lot of opportunities for viewing the screen from theoblique direction, it is preferable to use a light emitting device. Aspecific example of the electronic appliances is shown in FIG. 25.

FIG. 25A shows an OLED display device, comprising a housing 2001, asupporting base 2002, a display part 2003, a speaker part 2004, a videoinput terminal 2005, or the like. The light emitting device of thepresent invention can be used for the display part 2003. Since the lightemitting device is of a spontaneous light emitting type, backlighting isnot necessary, and thus a display part thinner than a liquid crystaldisplay can be provided. The OLED display device includes all thedisplay devices for displaying information, such as a personal computer,a TV broadcast receipt, and an advertisement display.

FIG. 25B shows a digital still camera, comprising a main body 2101, adisplay part 2102, an image receiving part 2103, an operation key 2104,an outside connection port 2105, a shutter 2106, or the like. The lightemitting device of the present invention can be used for the displaypart 2102.

FIG. 25C shows a lap top type personal computer, comprising a main body2201, a housing 2202, a display part 2203, a key board 2204, an outsideconnection port 2205, a pointing mouse 2206, or the like. The lightemitting device of the present invention can be used for the displaypart 2203.

FIG. 25D shows a mobile computer, comprising a main body 2301, a displaypart 2302, a switch 2303, an operation key 2304, an infrared ray port2305, or the like. The light emitting device of the present inventioncan be used for the display part 2302.

FIG. 25E shows a portable type image reproducing device comprising amemory medium (specifically, a DVD reproducing device), comprising amain body 2401, a housing 2402, a display part A 2403, a display part B2404, a memory medium (DVD, or the like), a reading part 2405, anoperation key 2406, a speaker 2407, or the like. The display part A 2403displays mainly the image information, and the display part B 2404displays mainly the character information. The light emitting device ofthe present invention can be used for the display parts A, B 2403, 2404.The image reproducing device comprising the memory medium includes adomestic game appliance.

FIG. 25F shows a goggle type display (head mount display), comprising amain body 2501, a display part 2502, and an arm part 2503. The lightemitting device of the present invention can be used for the displaypart 2502.

FIG. 25G shows a video camera, comprising a main body 2601, a displaypart 2602 a housing 2603, an outside connection port 2604, a remotecontrol receiving part 2605, an image receiving part 2606, a battery2607, a sound input part 2608, an operation key 2609, or the like. Thelight emitting device of the present invention can be used for thedisplay part 2602.

Here, FIG. 25H shows a portable phone, comprising a main body 2701, ahousing 2702, a display part 2703, a sound input part 2704, a soundoutput part 2705, an operation key 2706, an outside connection port2707, an antenna 2708, or the like. The light emitting device of thepresent invention can be used for the display part 2703. By displayingwhite characters on a black background in the display part 2703, thecurrent consumption can be restrained for the portable phone.

In the case the light emitting luminance of the organic light emittingmaterial is made higher in the future, it can be used also in a fronttype or rear type projector by enlarging and projecting a lightincluding the outputted image information by a lens, or the like.

Moreover, in the above-mentioned electronic appliances, the informationprovided through an electronic communication network, such as theInternet and a CATV (cable television) is displayed often, inparticular, the opportunities for displaying video information areincreased. Since the response speed of the organic light emittingmaterial is extremely high, the light emitting device is preferable forthe video display.

Furthermore, since a part emitting a light in the light emitting deviceconsumes the electric power, it is preferable to display the informationwith the light emitting part reduced to the minimum level. Therefore, inthe case the light emitting device is used for the display part mainlyhaving the character information, such as a portable informationterminal, in particular, a portable phone, and a sound reproducingdevice, it is preferable to drive such that the character information isprovided as a light emitting part with a non-light emitting partprovided as the background.

As heretofore explained, the present invention can be adopted in anextremely wide range, and thus it can be used for the electronicappliances in all the fields. Moreover, the electronic appliance of thisexample can employ the light emitting device of any configuration shownin the examples 1 to 13.

According to the above-mentioned configuration, the light emittingdevice of the present invention can obtain a certain luminance withoutthe influence by the temperature change. Moreover, in the color display,even in the case an OLED having different organic light emittingmaterials for each color is provided, inability of obtaining a desiredcolor by individual change of the OLED luminance of each color due tothe temperature can be prevented.

1. (canceled)
 2. A light emitting device comprising: a first transistorand a second transistor over a substrate; a first pixel electrodeelectrically connected to the first transistor; a first light emittinglayer over the first pixel electrode; a second pixel electrodeelectrically connected to the second transistor; a second light emittinglayer over the second pixel electrode; a counter electrode over thefirst light emitting layer and the second light emitting layer; and alead line overlapped with the counter electrode, wherein the lead lineis in direct contact with the counter electrode.
 3. The light emittingdevice according to claim 2, wherein the counter electrode is atransparent conductive film.
 4. The light emitting device according toclaim 2, wherein the substrate is a plastic substrate.
 5. The lightemitting device according to claim 2, further comprising an organicresin film partially overlapping the first pixel electrode and thesecond pixel electrode, and a conductive layer over the organic resinfilm.
 6. The light emitting device according to claim 2, wherein theconductive layer is copper.
 7. The light emitting device according toclaim 2, wherein the conductive layer extends in a perpendiculardirection to the lead line.
 8. The light emitting device according toclaim 2, wherein the light emitting device is incorporated in oneselected from the group consisting of a phone, a personal digitalassistant, a portable game machine, a digital camera, and a notebookpersonal computer.
 9. A light emitting device comprising: a glasssubstrate; a first transistor and a second transistor over the glasssubstrate; a first pixel electrode electrically connected to the firsttransistor; a first light emitting layer over the first pixel electrode;a second pixel electrode electrically connected to the secondtransistor; a second light emitting layer over the second pixelelectrode; a counter electrode over the first light emitting layer andthe second light emitting layer; and a lead line overlapped with thecounter electrode, wherein the lead line is in direct contact with thecounter electrode.
 10. The light emitting device according to claim 9,wherein the counter electrode comprises a transparent conductive film.11. The light emitting device according to claim 9, further comprisingan organic resin film partially overlapping the first pixel electrodeand the second pixel electrode, and a conductive layer over the organicresin film.
 12. The light emitting device according to claim 9, whereinthe conductive layer is copper.
 13. The light emitting device accordingto claim 9, wherein the conductive layer extends in a perpendiculardirection to the lead line.
 14. The light emitting device according toclaim 9, wherein the light emitting device is incorporated in oneselected from the group consisting of a phone, a personal digitalassistant, a portable game machine, a digital camera, and a notebookpersonal computer.